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The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Stencil Printing of Small Apertures
Elemental Compositions of Over Two Dozen Cell Phones
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TIM & Thermal Gap Filler Dispensing - Download our new guide for process considerations and popular configurations.
IPC Certification Training from the comfort of your home or office. See our 2024 Training schedule now.
Benchtop Fluid Dispenser
Text Ad | "DONGGUAN KINGSUN AUTOMATION provides new & used SMT machines, peripheral equipment and accessories sales; Equipment maintenance & technical services, SMT full line solution and Clean Room/ESD engineering materials production, design, and installation services."
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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