The SlimPro, and Standard Pro Feeders from Automation Technical Services solve the problem of accommodating your 0201 SMT component requirements with existing Quad/Tyco assembly equipment platforms. These Feeders are designed to accurately pick 020
MX200P has a IPC9850 Speed of 15,000CPH. 4 Modular Heads, 1 Precision Head, capable of inspecting and placing parts from 01005's (0402 metric) through 1.96"x 1.96" square, or 3.54" x 1.18" rectangular.Pitch capablity 12 mil, 80 feeder slots. All Mir
Configuration ● nozzle changer ● fixed vision camera ● windows based s/w ● manuals & s/w included Advanced Flying Vision System The Flying Vision System, developed by Samsung, utilizes separate cameras for each of the 6 heads. Standard pa
Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.
Mx400L has an IPC 9850 speed of 42,000 CPH. It will accomodate a PCB size up to 26.77" x 18.11", it has 6 module heads on the front gantry, 6 module heads on the rear gantry. minimum lead pitch is 15mil, and it will place parts down to 01005 (0402 me
SMT pick and place machine for prototype to low volume PCB assembly. Features software guidance, programming via CAD data transfer, loose parts handling, and camera vision.
Shenzhen Zhuomao Technology Co., Ltd. Specialized in BGA/SMT Rework, Reballing, SMD LED (LED Display Module) Repair, TV LCD Laser Repair, X-Ray Inspection Machine Since 2005. We design and development of customized Non-standard BGA Rework System in
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Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
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