In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board.
To get a quote or obtain more information on the IR 1000, visit the link below:
https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html
