The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
03014616S01 HOSE/EXHAUST AIR C+P20 03014654S01 HOSE / ADAPTER EXHAUST AIR C+P 20 03015194-01 NOZZLE TYPE 1035 compl 03015222-01 NOZZLE TYPE 1235 COMPLETE 03015384-01 NOZZLE TYPE 1135 compl./ 2 part Nozzle 03015388S05 PCB / 1-WIRE PPW C+P 030154
telescopic lifting conveyor /gateway telescopic conveyor/PCB conveyor, https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/1PCB Telescopic lifting conveyor is used to make passage in the PCB intelligent assembly line to give the opera
UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration
PCB flip conveyor and PCB invertor mainly use for turnover the PCB in 180 degree for double side processing. check the link to know more for this pcb conveyor: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/93.html ASCEN major
