Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards.
| 1 |
