Industry Directory | Manufacturer
professional manufacturer of pcb
Industry Directory | Manufacturer
PCB Global is a dedicated Prototype Quick Turn High Tech. PCB supplier - Quotes and orders can be processed 24/7/365 - free online quotation visit www.pcbglobal.com
Available on 2mm, 0.8mm and 0.50" centers in various contact configurations and heights they are useful for PCB stacking applications.
New Equipment | Assembly Services
Technic Feature Layer Count:6Layer Board Thicknes:0.8mm Surface Finish:ENIG Application Field:Automotive
Electronics Forum | Mon Nov 15 15:31:54 EST 2004 | GP
We are looking for machine that can do the following: bonding of 0.5x0.5x0.8mm mm cramic part. - detect target surface position 1.5x0.8mm - dispance a drop of 0.8mm of epoxy adhesive on trget surface with position accuracy of +/-0.04mm. - pick the 0.
Electronics Forum | Thu Jun 23 11:56:51 EDT 2005 | wjxingggg
Hi, all. There is one 0.8mmX0.8mm QFN on almost of our PWBAs. But the quality report showed that we got bad solder quality for this component. My question is which elements are the root cause for this situation frequently? Thanks.
Used SMT Equipment | Depanelizers / Routers
Key Features Solution for stress free depanelization Fixture-based highly efficient dust vacuum system Clean and precise depanelization for densely populated PCBs Advanced image-processing software offers point-and-click operation fo
Used SMT Equipment | In-Circuit Testers
TAKAYA APT9411CE Needle count: the upper 4 (movable) under lateral 2 rings (not moving) Detection speed: the highest 0.08 ~ 0.08 SEC/step Repeated positioning accuracy within + - 50 um Tip the minimum test distance is about 0.2 mm Maximum size p
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Parts & Supplies | SMT Equipment
SHAKE ARM ASM 8MM Part Name：SHAKE ARM ASM 8MM Part No：E13037060A0 Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-13170471806
Parts & Supplies | SMT Equipment
JUKI2000 TapeGuide Part List: E1102-706-0A0 WHEEL 2ASM E11027060A0 FF8mm-FF24mm, P-4mm E2102-706-0A0 WHEEL 4ASM E21027060A0 FF8mm-FF24mm, P-4mm E1103-706-CA0 WHEEL 2mm ASM E11037060A0 CTF8X2, ATF8X2 E2103-706-CA0 WHEEL 4mm ASM E21037060A0 CTF
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Features ●Suitable for high hardness aluminum, copper LED strip PCB. Two PCBAS can be separated at a time (ML-360B). ●Applicable PCB material:Aluminum,Copper,etc. ●Manually feding and precise positioning to separate PCBA. ●Progressive separation of f
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