Industry Directory | Manufacturer
Inovaxe is focused on developing state-of-the-art Inovative Material Handling Solutions (MHS) for Low-Volume/High-Mix Manufacturing.
Industry Directory | Manufacturer
Contract Electronics Manufacturers also providing completely integrated warehousing and logistics services to provide one stop total fulfilment services
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Mon Sep 18 11:55:35 EDT 2000 | Ricardo Fuentes
Hi! cold someone advise me about the minimum gap allowable in between 0404 parts. The minimum distance is because of the behavior on reflow, the re-work difficulty or anything else. Thanks
Electronics Forum | Mon Sep 18 20:51:35 EDT 2000 | Dave F
A fairly dense brickwall would have 0.020" (0.05mm) spacing
Used SMT Equipment | SMT Equipment
Samsung SM471 mounter Product Name: Samsung SM471 high speed chip mounter Product number: SM471 Detailed product introduction Samsung SM471 high speed chip mounter r parameters High speed Chip machine SM471 is each mount head with 10 shaft an
Used SMT Equipment | Pick and Place/Feeders
Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip(90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (ordiagonal Long 47m) Feeder number: up to 120 (using
Industry News | 2018-10-17 18:50:57.0
IPC's Validation Services Program has awarded an IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to AirBorn Inc. for its two locations, one in Georgetown, Texas and the other, in Lake City, Pa. Following an initial audit by IPC, AirBorn Inc. becomes one of the original equipment manufacturer (OEM) trusted sources and suppliers meeting the stringent requirements of the Qualified Manufacturing Listing (QML) based on one of IPC's foremost standards: IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.
Industry News | 2022-05-05 17:28:46.0
Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste
Parts & Supplies | SMT Equipment
Yamaha PBSA 16X30-7-1062W air cylinder More Yamaha parts in stock Yamaha Feeders YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-000 Ya
Parts & Supplies | SMT Equipment
Yamaha PBSA 16X30-7-1062W air cylinder More Yamaha parts in stocks KG3-M7190-00X Yamaha Needle Connector 12YM KGT-M7106-00X Yamaha YG200 Shaft Nozzle Holder KHN-M7720-A1X Yamaha YS12 302A Nozzle KHN-M7790-A1X Yamaha YS12 309# Nozzle KHY-M7106
Technical Library | 2019-11-07 08:59:14.0
Inductors realized with high permeable MnZn ferrite require, unlike iron-powder cores with an inherent dis-tributed gap, a discrete air gap in the magnetic circuit to prevent saturation of the core material and/or tune the inductance value. This large discrete gap can be divided into several partial gaps in order to reduce the air gap stray field and consequently the proximity losses in the winding. The multi-gap core, realized by stacking several thin ferrite plates and inserting a non-magnetic spacer material between the plates, however, exhibits a substan-tial increase in core losses which cannot be explained from the intrinsic properties of the ferrite. In this paper, a comprehensive overview of the scientific literature regarding machining induced core losses in ferrite, dating back to the early 1970s, is provided which suggests that the observed excess core losses could be attributed to a deterioration of ferrite properties in the surface layer of the plates caused by mechanical stress exerted during machining.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
SMTnet Express, January 15, 2014, Subscribers: 26472, Members: Companies: 13551, Users: 35633 Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices by Brian Czaplicki; Air-Vac Engineering BGA
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/altium-0402-resistor-footprint_topic2596_post10574.html
Altium 0402 Resistor Footprint - PCB Libraries Forum - Page 2 Forum Home > Libraries > Footprints / Land Patterns > Altium New Posts FAQ Search Events Register Login Altium 0402 Resistor Footprint
KingFei SMT Tech | https://www.smtspare-parts.com/sale-37303915-panasonic-msh3-nozzle-0402-0805-0603-1-6-2-2-2-5.html
Panasonic MSH3 Nozzle 0402 0805 0603 1.6 2.2 2.5 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
