CMTL�s Advanced Qualification Test Summary for Ramtek Inc.�s Thermally Managed, Heat Dissipating, STABLCOR 1 Gigabyte, PC133, 168 pin DIMM Memory Module for Intel Corporations SBT2 ( Baytown )server. PASSED System Type:SBT2 (Baytown) Intel PC133 Ma
New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
Electronics Forum | Mon Jan 22 20:14:52 EST 2001 | davef
Take note that contrary to popular belief, it is not acceptable to assume that the floor life clock will be temporarily stopped when components are put back in dry storage following exposure to ambient conditions exceeding one hour. ... why doesn�t
Electronics Forum | Thu Aug 23 15:38:58 EDT 2001 | mparker
Bingo - the mylar is the problem. Ask the fab vendor what storage and humidity controls they use on the photo tools. The films can changed geometry from day to day depending on the ambient environment. What controls are used during production? The ra
Industry News | 2001-10-04 09:54:13.0
Surface Mount Techniques has announced that all of the company's higher-end semi-automated and fully automatic screen and stencil printing machines using Windows graphical user interface for control are now equipped, as standard, with the Windows NT Operating System.
Industry News | 2001-05-21 13:24:29.0
Uses less chemistry, generates less wastewater and cleans solder paste, adhesives and flux residue in one system!
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ C7061F2001 ULTRAVIOLET FLAME DETECTOR DYNAMIC SELF CHECKING PURPLE PEEPER 120VAC 3/4 INCH MOUNTI
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. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
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