Electronics Forum | Mon May 10 16:51:32 EDT 1999 | Ruby Zheng
| Can anyone tell me what the recommended material for molding with thermal expension coeffecient around 20ppm and transparent for lightwave 850nm. Thanks |
Electronics Forum | Fri Aug 08 13:21:14 EDT 2008 | RobP
With AOI it really depends on what you are testing. Not only what criteria, but what different types of components. We run a high volume low mix application for automotive checking for presense, positional accuracy, and all solder joints. We curre
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