Industry Directory | Manufacturer
Manufacturer of vapor phase soldering systems and associated products since 1985.
Industry Directory | Manufacturer
R&D Technical Services was formed in 1996 to support the Vapor Reflow market and is currently the leading source of Vapor Phase equipment.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
New Equipment | Soldering - Other
ASSCON Vapor Phase Soldering: ASSCON VP2100 Vacuum, ASSCON VP800 Vacuum, ASSCON VP6000 Vacuum & ASSCON VP7000 Vacuum
Used SMT Equipment | Soldering - Reflow
REHM Condenso-Batch Vacuum Vapor Phase Oven Year 2008 Voltage: 3 x 400V 50 Hz Power 20 kW Cooling 20 l/m Compressed air 8 bar Suction 400 m3/h Length 290 cm, Width 130 cm, Height 165 cm Ready for delivery.
Used SMT Equipment | Soldering - Reflow
REHM Condenso-Batch Vacuum Vapor Phase Reflow Oven Year 2008 Tension: 3 x 400V 50 Hz Power 20 kW Cooling 20 l/m Compressed air 8 bar Aspiration 400 m3/h Length 290 cm, Width 130 cm, Height 165 cm
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Industry News | 2018-04-16 20:18:35.0
SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Nano-copper sintering in formic acid vapor.
ASSCON Vapor Phase Soldering: ASSCON VP2100 Vacuum, ASSCON VP800 Vacuum, ASSCON VP6000 Vacuum & ASSCON VP7000 Vacuum
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Longmont, Colorado USA | Engineering,Maintenance,Technical Support
FIELD SERVICE ENGINEER I JOB DESCRIPTION A-Tek Systems Group is an electronics equipment distributor specializing in factory automation – specifically with depaneling, vapor phase soldering, selective soldering and cleaning. A-Tek is headqu
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Purchasing,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
SMTnet Express, March 20, 2014, Subscribers: 22559, Members: Companies: 13833, Users: 35907 Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering. Dipl.-Ing. Helmut Leicht; Andreas Thumm; IBL-Löttechnik Gmb
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
? The chemistry involved with formic acid reflow is a two-step process: During the soak phase of a thermal profile (between ~ 150C and 200C), formic acid vapor is introduced into the process chamber where it reacts with the metal oxides on the solder and creates formate salts
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