We manufacture multi PCB up to 12 layer,The details of our capabilities:*Micro fine line to 4 mil *Blind & buried via hole *Flying-probe testing *Carbonlack *FR4 thickness: 0.3/0.4/0.8/1.0/1.2/1.5/2.0/2.4/3.2mm *Small quantities are available *Golden finger *HAL & chemical tin
New Equipment | Solder Materials
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process
Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c
Used SMT Equipment | In-Circuit Testers
Make: GenRad Model: 2284i In-Circuit Tester Operating System: Windows XP Software RLS: R 5.2.0 Details: CPU_TYPE PC OS_TYPE
Used SMT Equipment | Soldering - Wave
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the features an
Industry News | 2018-08-09 12:24:23.0
Seika Machinery is pleased to announce that it carries six new process control devices from MALCOM and UNITECH. These include: SPS series paste mixers, viscometers, wetting balance testers, profilers / camera systems, reflow simulators and PCB board cleaners.
Parts & Supplies | Pick and Place/Feeders
SONY E1000 nozzle AF05021 SONY E1000 PICK UP NOZZLE0.45 /0.2 AF06040 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF06041 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF08050 SONY E1000 PICK UP NOZZLE0.8 /0.5 AF10070 SONY E1000 PICK UP NOZZLE1.0 /0.7 AF10071
Parts & Supplies | Pick and Place/Feeders
SONY E1000 nozzle AF05021 SONY E1000 PICK UP NOZZLE0.45 /0.2 AF06040 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF06041 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF08050 SONY E1000 PICK UP NOZZLE0.8 /0.5 AF10070 SONY E1000 PICK UP NOZZLE1.0 /0.7 AF10071 SONY E
Inline UV PCB Laser Depaneling Machine Inline UV PCB Laser Depaneling Instruction: PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics
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QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/md10x30s-0-dmsg-2-cylinder-228435?page=346&order=name+asc
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