2510F01 FRAC HP MOTOR STARTER SW SquareD 2510MBG2 Manual SquareD 2510MC03 STARTER SquareD 2936S1C27A MAGNET COIL SquareD 2NR600 TRANSFORMER SquareD 2S1F TRANSFORMER DRY 1PH 2KVA 240X480V-120/240V SquareD 30009 DOUBLE TIER RELAY SOCKET SquareD
The BWT-104WA is a research quality, open loop, benchtop wind tunnel for thermal characterization of components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates. The polynomial shape and internal flow management
Electronics Forum | Wed Jan 29 08:32:48 EST 2020 | dontfeedphils
I'm currently running Grid-Lok in my printer and have used it almost exclusively in the past. That being said, I'm looking for a solution to help correct/remove sag and warpage on PCBs that will run through our TRI SPI and AOI. I have no doubt th
Industry News | 2020-02-18 14:50:19.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
Industry News | 2020-01-29 07:33:26.0
IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
Career Center | Karachi, Pakistan | Engineering,Maintenance,Research and Development,Sales/Marketing,Technical Support
• Experienced in SMT Production, working on Siplace X Series-S and DEK-Micron Printer, on Siplace Pro and Siplace Explorer. • Having Strongly Skills of calibration of SMT machine, twin head, Multi star head, speed star head, gentry, Nozzles, feeders,
Career Center | Cebu, Philippines | Engineering,Maintenance,Technical Support
Experience SMT machine maintenance and SMT process from raw materials to finish goods
SMTnet Express, Octomer 15, 2020, Subscribers: 28,116 , Companies: 11,144, Users: 26,166 Fracture Toughness Of Thermally Conductive Adhesives Credits: Henkel Electronic Materials Thermally conductive adhesives provide many advantages
SMTnet Express, September 24, 2020, Subscribers: 28,209, Companies: 11,117, Users: 26,131 COVID is changing your business, making it more difficult to meet face-to-face with customers. SMTnet puts you directly in front of 600,000+ engineers
Heller Industries Inc. | https://hellerindustries.com/award/best-practices/
Curing Applications Low Void Curing SW and Automation Videos & Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects
GPD Global | https://www.gpd-global.com/ipc-apex-expo-2020.php
IPC APEX Expo 2020 Fluid Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
2762 Loker Ave West
Carlsbad, CA USA
Phone: 18002796835
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