SMT Lead-Free SMD Reflow Soldering Oven for LED Production Line ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience |
SMT Line 6 Heating Zones Reflow Oven ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional oversea serv
Electronics Forum | Wed Jan 29 08:32:48 EST 2020 | dontfeedphils
I'm currently running Grid-Lok in my printer and have used it almost exclusively in the past. That being said, I'm looking for a solution to help correct/remove sag and warpage on PCBs that will run through our TRI SPI and AOI. I have no doubt th
Used SMT Equipment | Labeling Systems
Zebra 96 XiIII Plus *multiple units available* Standard Features:Full function front panel and multilingual back-lit LCD display with user programmable password protectionFlash memory including 2.0MB non-volatile memory storage for downloadable objec
Industry News | 2020-06-30 15:07:32.0
MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.
Industry News | 2020-02-18 14:50:19.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
Career Center | Karachi, Pakistan | Engineering,Maintenance,Research and Development,Sales/Marketing,Technical Support
• Experienced in SMT Production, working on Siplace X Series-S and DEK-Micron Printer, on Siplace Pro and Siplace Explorer. • Having Strongly Skills of calibration of SMT machine, twin head, Multi star head, speed star head, gentry, Nozzles, feeders,
Career Center | Cebu, Philippines | Engineering,Maintenance,Technical Support
Experience SMT machine maintenance and SMT process from raw materials to finish goods
SMTnet Express, Octomer 15, 2020, Subscribers: 28,116 , Companies: 11,144, Users: 26,166 Fracture Toughness Of Thermally Conductive Adhesives Credits: Henkel Electronic Materials Thermally conductive adhesives provide many advantages
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Heller Industries Inc. | https://hellerindustries.com/award/best-practices/
Curing Applications Low Void Curing SW and Automation Videos & Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects
GPD Global | https://www.gpd-global.com/ipc-apex-expo-2020.php
IPC APEX Expo 2020 Fluid Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
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