Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | X-Ray Inspection
CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Sold
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:37:45.0
Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.
Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to
BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class "A" Instructors and are qualified to teach the 2 day Worker Proficiency training and certif
Training Courses | ON DEMAND | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Training Courses | ON DEMAND | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Events Calendar | Mon Oct 14 18:30:00 UTC 2024 - Wed Oct 16 18:30:00 UTC 2024 | ,
GfKOOR Series | Seminar Application and Utilisation of Protective Coatings for Electronic Assemblies
Events Calendar | Wed Apr 24 18:30:00 UTC 2024 - Wed Apr 24 18:30:00 UTC 2024 | 1146 Budapest, Dózsa György út 1,
Advanced Electronics Assembly Conference (AEAC) at Innoelectro Budapest
Career Center | Rolling Meadows, USA | Quality Control
Technical Trainer Professional solder training company is seeking individual to teach solder skills-based training as well as other electronics assembly courses. Individual should be able to communicate effectively with others. Training or teaching
Career Center | Fredericksburg, Virginia USA | Production
Electronic Assembler Position Pay Rate $9 - $16 per hour - TTP We are looking for an Electronic Assembler with broad technical and manufacturing experience. This position performs all manufacturing operations in a fast-paced contract manufacturing P
Career Center | rochester, New York USA | Engineering,Management,Quality Control
Lean Manufacturing, Six Sigma experience. Design of experiments experience with the entire process. Six sigma tools including DMAIC 5S Kaizen Kanban, and many more. Proficient in all Office products including project.
Career Center | , haryana India | Engineering,Maintenance,Management,Production
Ten year in Production SMT, Maintenance & Assembly & Electronics Energy meter
SMTnet Express, April 13, 2023, Subscribers: 24,673, Companies: 11,756, Users: 27,889 █ Electronics Manufacturing Technical Articles How Clean Is Clean? Over the past several years, post-reflow defluxing of circuit assemblies has
SMTnet Express, June 15, 2023, Subscribers: 24,830, Companies: 11,818, Users: 28,067 █ Electronics Manufacturing Technical Articles Stencil Design For Mixed Technology Through-Hole / Smt Placement And Reflow This paper will review
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/industries/electronics-assembly-and-packaging?con=t&page=7
Electronics - Assembly & Packaging | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
| https://www.eptac.com/blog/the-biggest-challenges-currently-facing-the-electronics-manufacturing-industry
– adding another layer to the electronics manufacturing industry. Micro parts require micro machines that are small enough to assemble these smart devices through micro dispensing of adhesives, and this is where the challenge lies
