EcoTech distributes new and reprocessed plastic IC trays for use in the testing, baking, handling and shipping of Surface Moount ICs.
Tape & Reel, Lead Inspection, Lead Repair, Moisture Bake. Vacuum Seal, Qa Inspection services for the IC Manufactures, Contract Manufactures and Distributer. Based in the Heart Silicon Valley.
T40W-1200-6 is a plug and play, fully auto dry cabinet which will be stable at 40C and 15C. Fresh News We will participate Productronica 2015 show. The world’s leading trade fair for electronics development and production. http://www.productroni
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Electronics Forum | Mon Jun 28 15:03:43 EDT 2004 | jdumont
If you dont mind me asking, what are you guys using to keep your IC's dry??
Electronics Forum | Mon Jun 28 14:48:56 EDT 2004 | jdumont
Yes i was looking around that site this morning and found everything i needed. Thanks to all. Basically what im trying to do is justify the expenditure of a new NO2 generator for our IC cabinets. Ours died a little while back and we have been using
Industry News | 2013-05-16 11:14:05.0
Seika Machinery, Inc., announces its Spring discount sale on McDry Ultra-Low Humidity Storage Cabinets, effective through May 31, 2013.
Industry News | 2013-05-31 09:46:35.0
Seika Machinery, Inc., announces that several of its McDry Ultra-Low Humidity Storage Cabinets are ideal for medical device applications.
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
