Industry Directory: barrel fill selective soldering (2)

MatriX Technologies GmbH

Industry Directory | Manufacturer

Manufacturer of Real-time Automated Xray Inspection. Focus on SMT solder joint inspection of hidden joints ie, BGAs and PTH Barrel Fill per IPC-610. Clients include leading manufacturers in the electronics/automotive Industries.

PROPOX Sp. z o.o.

Industry Directory | Consultant / Service Provider / Manufacturer

PROPOX is a manufacturer of electronics, industrial automatics, telemetric systems, tools, modules and evaluation circuits used by the constructors of electronics.

New SMT Equipment: barrel fill selective soldering (6)

SelectaFlux A Ultrasonic fluxing system for selective wave solder process

SelectaFlux A Ultrasonic fluxing system for selective wave solder process

New Equipment | Selective Soldering

Designed to replace other fluxing systems in selective fluxing applications, Sono-Tek’s ultrasonic selective fluxing system offers the highest degree of accuracy and fine line control. Controlled velocity spray will give maximum top side fill and low

SONO-TEK CORPORATION

Liquid Solder Flux

Liquid Solder Flux

New Equipment | Solder Materials

Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new acti

Kester

Electronics Forum: barrel fill selective soldering (169)

THM Solder barrel fill issues on 93 mils board

Electronics Forum | Wed Aug 21 17:03:13 EDT 2013 | hegemon

I think your pre-heat temp is a little low for SAC 305 Soldering. Especially with a Pallet. You might want to try to add some time and temp to get the PWB itself preheated up to 150-160C. That should help with the barrel fill. Make sure your board

THM Solder barrel fill issues on 93 mils board

Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew

I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag

Used SMT Equipment: barrel fill selective soldering (4)

ACE Kiss 102

ACE Kiss 102

Used SMT Equipment | Soldering - Selective

Vintage:  2007 Details: • Leaded-currently filled with solder • Single Pot • Topside Preheat • Nitrogen capable         • Set up camera • Spray fluxer • 3 nozzles included Condition:  Complete & Operational Location:  LCI FL  / FOB origin

Lewis & Clark

ACE KISS 103 ILDP Selective Solder

ACE KISS 103 ILDP Selective Solder

Used SMT Equipment | Soldering - Selective

Make:  Nordson ACE Model: KISS 103ILDP Description:  This is Dual Pot Inline selective soldering system, with two selective soldering machines, tied together that can be run independently OR as a single inline selective system. This syste

Lewis & Clark

Industry News: barrel fill selective soldering (103)

Integrate Advanced Precision Auger Pump for Dispensing Small Volumes down to 01005

Industry News | 2016-08-25 17:56:34.0

GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.

GPD Global

SMTA South East Asia Technical Conference on Electronics Assembly Program Finalized

Industry News | 2018-03-13 18:51:40.0

SMTA is excited to announce the technical program has been finalized and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held May 8-10, 2018 at the MITEC in Kuala Lumpur, Malaysia.

Surface Mount Technology Association (SMTA)

Technical Library: barrel fill selective soldering (5)

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Technical Library | 2019-06-21 10:39:15.0

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.

ACI Technologies, Inc.

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2021-09-29 13:35:21.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.

Vitronics Soltec

Videos: barrel fill selective soldering (32)

Electrovert Wave Soldering

Electrovert Wave Soldering

Videos

In the wave soldering industry, Electrovert® holds the industry reputation for having the most innovative technologies, best performance, highest reliability, and as being the best investment over a long product life cycle. Electrovert’s® Electra™, V

ITW EAE

The Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers.

The Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers.

Videos

DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl

ITW EAE

Training Courses: barrel fill selective soldering (3)

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Justice Electronic Training Services

Events Calendar: barrel fill selective soldering (3)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Taiwan Alliance LTS Workshop

Events Calendar | Wed Aug 21 00:00:00 EDT 2024 - Wed Aug 21 00:00:00 EDT 2024 | Kaohsiung City, Taiwan

Taiwan Alliance LTS Workshop

Surface Mount Technology Association (SMTA)

Career Center - Resumes: barrel fill selective soldering (5)

SMT Process Engineering Specialist

Career Center | Kitchener, Ontario Canada | Engineering,Maintenance,Technical Support

Knowledgeable in Design of Experiments (DOE), Design for Manufacturability (DFM), Statistical Process Control (SPC), Failure Mode & Effects Analysis (FMEA) and Root Cause Analysis that drives continuous improvement in package reliability.  A recogniz

Operations Manager

Career Center | Stouffville, Ontario Canada | Management

95% on time delivery. Measures daily manufacturing performance versus plan, and work with manufacturing and engineering to determine and communicate corrective actions to maintain on-plan performance. Develops and maintains inventory management sys

Express Newsletter: barrel fill selective soldering (1011)

SMTnet Express - December 23, 2015

SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P

SMTnet Express - February 27, 2015

SMTnet Express, February 27, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Position Accuracy Machines for Selective Soldering Fine Pitch Components Gerjan Diepstraten; Vitronics Soltec B.V. The drive towards fine pitch

Partner Websites: barrel fill selective soldering (175)

75% Barrel Fill Requirement for Class 2 Change in J-STD-001 Revision F - EPTAC - Train. Work Smarter

| https://www.eptac.com/faqs/ask-helena-leo/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f

75% Barrel Fill Requirement for Class 2 Change in J-STD-001 Revision F - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Nordson ACE KISS 103 ILDP Selective Solder 2015 - Lewis and Clark

Lewis & Clark | https://www.lewis-clark.com/product/nordson-ace-kiss-103-ildp-selective-solder/

:  KISS 103ILDP Description:   This is Dual Pot Inline selective soldering system, with two selective soldering machines, tied together that can be run independently OR as a single inline selective system

Lewis & Clark


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