Industry Directory | Manufacturer
Manufacturer of Real-time Automated Xray Inspection. Focus on SMT solder joint inspection of hidden joints ie, BGAs and PTH Barrel Fill per IPC-610. Clients include leading manufacturers in the electronics/automotive Industries.
Industry Directory | Consultant / Service Provider / Manufacturer
PROPOX is a manufacturer of electronics, industrial automatics, telemetric systems, tools, modules and evaluation circuits used by the constructors of electronics.
New Equipment | Cleaning Equipment
QYSMT MOREL Electirc fixture cleaning machine SMS-5200 SMS-5200 electric fixture cleaning machine is mainly used for flux cleaning on the surface of wave soldering fixtures, and can also be used to clean reflow soldering trays, filters, wave solde
New Equipment | Wave Soldering
JT Wave Soldering Machine WS-350 No. of preheating zones:4 Preheating length: 1800mm Control system: PC + PLC Dimensions:3600 x 1350 x 1750 Product description: JT Wave Soldering Machine WS-350, No. of preheating zones:4, Preheating length: 1
Used SMT Equipment | Soldering - Selective
Vintage: 2007 Details: • Leaded-currently filled with solder • Single Pot • Topside Preheat • Nitrogen capable • Set up camera • Spray fluxer • 3 nozzles included Condition: Complete & Operational Location: LCI FL / FOB origin
Used SMT Equipment | Soldering - Selective
Make: Nordson ACE Model: KISS 103ILDP Description: This is Dual Pot Inline selective soldering system, with two selective soldering machines, tied together that can be run independently OR as a single inline selective system. This syste
Industry News | 2016-08-25 17:56:34.0
GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Technical Library | 2015-02-27 17:06:01.0
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process window for designers. THT connectors can be soldered on the top and bottom side of boards, board in board, PCBs to metal shields or housing out of plastic or aluminum are today's state of the art. The materials that are used to make the solder connections require higher temperatures. Due to the introduction of lead-free alloys, the boards need more heat to get the barrels filled with solder. This not only affects the properties of the flux and components, but the operation temperatures of solder machines become higher (...)First the impact of temperature will be discussed for the separate process steps and for machine tooling. In the experimental part measurements are done to verify the accuracy that can be achieved using today's selective soldering machines. Dedicated tooling is designed to achieve special requirements with respect to component position accuracy.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
High-efficiency UV Curing Oven Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA conformal coating machine, smt coating machine,
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Events Calendar | Tue Aug 20 18:30:00 UTC 2024 - Tue Aug 20 18:30:00 UTC 2024 | Kaohsiung City, Taiwan
Taiwan Alliance LTS Workshop
Events Calendar | Mon Mar 25 18:30:00 UTC 2024 - Mon Mar 25 18:30:00 UTC 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
| https://www.eptac.com/faqs/ask-helena-leo/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f
75% Barrel Fill Requirement for Class 2 Change in J-STD-001 Revision F - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Lewis & Clark | https://www.lewis-clark.com/product/nordson-ace-kiss-103-ildp-selective-solder/
: KISS 103ILDP Description: This is Dual Pot Inline selective soldering system, with two selective soldering machines, tied together that can be run independently OR as a single inline selective system
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