reflowsystems.com manufactures and distributes three series of ovens to offer a perfect fit in size and price for every production need: 1) CORA 450 and 250 are combining not only COnvection and RAdiation to guarantee stressfree soldering of BGAs eve
New Equipment | Coating Materials
Technic Releases TechniFlex LCL1000F/423M New Flexible Black Soldermask for Direct Imaging Cranston, RI, USA - Technic has announced the release of TechniFlex LCL1000F/423M, an extremely durable, direct imaging, fine pitch, matte black solder mask
Electronics Forum | Fri Dec 27 17:40:55 EST 2019 | rgduval
Using no-clean flux will make the boards very difficult to clean. If you can switch to water soluble flux, your life will be much easier. The "icicles" lead me to think that the board isn't getting hot enough in the pre-heat cycle, and/or there isn
Electronics Forum | Mon Mar 22 15:05:52 EST 1999 | Scott
| | | | Looking for a company that makes a small batch reflow oven. Not a belt-style convection oven, but a cabinet style that can 125 c to 150 c. | | | | | | | | Thank you | | | | | | | TRY GE I HAVE ONE AT HOME THAT COOKES PRETY DARN GOOD. And i
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
SMT On-line 3D Solder Paste Inspection If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
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SMTA China East Conference 2018
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| https://www.smtfactory.com/Introduction-of-Lyra-Reflow-Oven-s-process-development-stage-id3093448.html
. For example, the package of SMD such as IC is black phenolic or epoxy, while the lead is white metal. When Lyra Reflow Oven is heated only, the temperature of the lead is lower than its black SMD body
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
-Free Soldering/Reliability Low Temperature Processing Low Volume/Prototype Non-Wet Open (NWO) Defects Package-on-Package Assembly Part Obsolescence Placement Printing Reflow Soldering/ Wave Soldering Rework and Repair of QFNs
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