Industry Directory | Distributor / Manufacturer
Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
New Equipment | Assembly Services
Printed Circuit Boards ("PCBs") should be viewed as electronic real estate. Essentially, the reliability of the components that, combined with the PCB, make up your product are only as good as the foundation upon which they are assembled. The relia
Electronics Forum | Tue Oct 27 16:22:00 EDT 2009 | davef
It's not the first thing we think of in looking at your picture. First off, the lack of copper in the region of the red oval makes us think of a plating defect. We don't expect that moisture out-gassing through the barrel wall to show-up on opposite
Electronics Forum | Thu Aug 13 12:55:46 EDT 1998 | Dave F
| Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | Xingsheng Xingsheng: Welcome. Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill Web resources: http://www.pwbrc.org/ a
Industry News | 2016-03-03 09:04:08.0
Count On Tools today announced the launch of ASM Siplace Metal Nozzle Magazines for 7xx/9xx Series machines. With each broken nozzle magazine, customers are throwing away money. Thanks to the introduction of this self-designed replacement nozzle magazine for Siplace collect-and-place machines, customers can expect much higher durability combined with significant cost savings and reduced waste.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Parts & Supplies | Adhesive Dispensers
6 2-689-734-01 ...-..-. (B-L) BASE (B-L), SENSOR 1 7 2-689-735-02 ..-... (F) SHOOT (LOWER (F)) 1 8 2-689-736-02 ..-... (R) SHOOT (LOWER (R)) 1 9 2-893-378-01 ..-. (SUS) SHOOT (SUS) 2 - 4-700-047-01 ................ (
Technical Library | 2019-06-06 00:19:02.0
More and more people and things are using electronic devices to communicate. Subsequently, many electronic products, in particular mobile base stations and core network nodes, need to handle enormous amounts of data per second. One important link in this communication chain is high speed pressfit connectors that are often used to connect mother boards and back planes in core network nodes. These new high speed pressfit connectors have several hundreds of thin, short and weak pins that are prone to damage. Small variations in via hole dimensions or hole plating thickness affect the connections; if the holes are too small, the pins may be bentor permanently deformed and if the holes are too large they will not form gas tight connections.The goal of this project was to understand how rework of these new high speed pressfit connectors affects connection strengths, hole wall deformations and plating cracks.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
ATTENDANT WET CHEMICAL PROCESSES) Hole wall preparatio
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-assembly-how-does-it-work/
. Some things to include are: Mechanical strength Electrical conduction Purity Soldering quality Lamination – Peel and strength Hole wall quality Component polarity, placement, alignment, positioning, etc
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
. Populated and unpopulated PCBs • View surface mount defects i.e. misaligned devices, solder joint porosity, bridging • Detailed inspection of vias, through-hole plating and multi-layer alignment
