Quick Overview Max 400×600 mm soldering area Infrared ic heater T962C works automatically by micro-computer control. Can satisfy a dissimilarity SMD、BAG Soldering a request. Whole soldering process to complete automatically, easy to use, Adoption
High Value Stencil Screen Printing Solutions from JUKI. The GL printers utilize a patented mathematical calculating algorithm to ensure the machine’s high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision and Opti
Electronics Forum | Wed Apr 14 17:39:20 EDT 1999 | Dave F
| Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | I consider "fines" individual unmelted metal spheres that are found in s
Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea
| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun
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Note the defect!KE68008521 - Calculator German MaxireflowKE68008130 - Acoustic alarm function (‘horn’) In addition to the red warning light, an acoustic signal is emitted in the event of an alarm.KE68008110 - Wind vane relay for monitoring the ext
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2020-07-07 13:52:57.0
SEHO Systems GmbH, is the right partner when innovative ideas are required. With the PowerVision, SEHO focuses on two key points in the manufacturing of THT assemblies: Continuous quality assurance and cost-efficient production processes.
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EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
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Solder Paste Qualification Testing - SMTA Webinar
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SMTnet Express, March 10, 2016, Subscribers: 24,118, Companies: 14,735, Users: 39,803 Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel, Aileen Allen, Elizabeth Elias Benedetto, Rahul Joshi; HP Inc. Since the implementation
SMTnet Express, September 9, 2021, Subscribers: 26,718, Companies: 11,435, Users: 26,839 Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates Manganese can
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. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
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0.25 kg for 250g strain gauge. Applying excessive weight to this clip, which measures the peel back force of the cover tape, may result in perma- nent damage to the unit
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