Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Leading supplier of Solid Solder Deposit (SSD) technology and equipment to the electronics industry. Mask Tek's patented PPT process eliminates solder paste at assembly. Ideal for fine pitch and BGAs. Please visit our web site at masktek.com.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
New Equipment | Assembly Services
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She
Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan
Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C
Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times
Used SMT Equipment | Soldering - Reflow
Configuration details: · Conveyor type: mesh/rail conveyor- single edge rail with mesh on bottom. · Chain lubrication. · 8 heater zones. · Configured Left to Right. · Air. Condition: In use, compl
Used SMT Equipment | Screen Printers
Make: Mydata Model: My500 Vintage: 12/2011 Description: Jet Printer Details: • Windows XP • Individual Deposit Programming • Quick Mode Programming • Automatic Board Stretch and Board Warpage Compensation
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Parts & Supplies | Repair/Rework
. This machine adopts industrial computer control, full automatic vision alignment system can acquire BGA and the PCB image through the CCD camera and collect them on the image positioning processing system, calculate the offset position and angle th
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
The ZEVAm+ selective soldering machine brings patented soldering technology that excels at meeting the challenges of miniaturization. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results for the ever decreasing pitch
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Events Calendar | Thu Apr 30 00:00:00 EDT 2020 - Thu Apr 30 00:00:00 EDT 2020 | ,
Screen Printing Key Factors
Career Center | Fort Worth, Texas USA | Production
The requirements for the Manufacturing Engineer are a BS in Engineering with surface mount device(SMD),surface mount technology (SMT) thru-hole, and wave solder knowledge. Also, experience in fixture design, developing manufacturing processes and rel
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | Lakewood, California USA | Engineering,Management,Production
Previous management / supervisor experience. Quality conscious, detail oriented supervisor / manager, with hands on approach to customer service Motivated with excellent communication skills and a dedicated team player. Qualifications include:
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Featured Article Return to Front Page REFLOW SOLDERING
| https://www.smtfactory.com/China-Automatic-Solder-paste-printer-Factory-Supplier-pd42676824.html
Solder Stencil Printer,solder paste stencil Machine,solder printing Machine,solder screen printing,PCB Printer Machine Price,Pcb Stencil Printer,Smt Stencil Printer Machine,Smt Printing Machine
| https://unisoft-cim.com/view-markup_quoting_solder-joint-count-defect-per-million-operations-dpmo-report.html
. Defect Per Million Operations (DPMO) There are a few options for calculating the Solder Joint Count using the Unisoft software. Two methods to determine the Solder Joint Count totals are outline below
