Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj
Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C
Electronics Forum | Tue Sep 11 10:13:58 EDT 2001 | davef
Yes, you cannot change the "subject" that you enter when first beginning a tread. This is what will appear on the Main Conference. You can change the very same "subject" as it appears when the thread is selected in one of the Forums with "edit" or
Industry News | 2019-04-10 10:19:18.0
(Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
to Front Page Solder Paste Measurement: A Yield Improvem
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
? Figure 1 on page 110 includes the “ideal” reflow profile. It is characterized by a 2° to 4°C/sec ramp to a dwell zone of 30 to 90 sec at approximately 150
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. This results in a reduced production yield and product defects that can significantly hamper your bottom line. Moisture sensitivity is a growing problem thanks to factors such as higher reflow temperatures, reductions in package body thickness, the increased use of plastics, and manufacturing in high-humidity
