Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Industry Directory | Manufacturer
IRC has been a leader in resistor technology, including the industry's comprehensive range of current sense resistors, precision discrete and networks, integrated passive components, and specialized power resistors.
SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
This module contains all SMT Plus Inc. standard components in EPD/AutoCAD library form. Visual and parametric libraries are provided. Just point and select a desired component from the hundreds of parts available and insert it into your layout drawi
Electronics Forum | Wed Aug 20 17:05:42 EDT 2008 | naynayno
We have experienced contamination under flat chip arrays. The lab report is still open but it appears to be dendrite growth. We have been trouble-shooting our process and cleaning equipment. My question is are there any specific design or best p
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Used SMT Equipment | Pick and Place/Feeders
Product number: YS100 Products indetail The
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Parts & Supplies | Chipshooters / Chip Mounters
Yamaha KM1-M7141-00X PACKING More Yamaha parts in stock YAMAHA FEEDER PARTS CL84/82 K87-M111H-20X BACK STOPPER K87-M111B-00X BACK STOPPER AXIS KW1-M111A-00X SPRING K87-M111G-10X PUSH PIN K87-M111C-00X PLANE WASHER K87-M111P-00X SCREW,FLAT
.jpg)
Parts & Supplies | Chipshooters / Chip Mounters
FUJI DCPH0641 Clutch H4445A BEARING,MINIATURE H4451A BEARING,MINIATURE H4440A BEARING,MINIATURE T2030T CHAIN T2022B CHAIN S3033A SPROCKET S3034A SPROCKET S1022A CIR-CLIP W10022 WASHER WQC4081 BKT CSQC1160 BRIDGE S3141B SW,PHOTOELECTRIC
Technical Library | 2000-11-13 20:45:03.0
Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips.
Technical Library | 2011-10-27 18:03:53.0
Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row
Link: https://www.ascen.ltd/Products/mask_making_machine/ This kind of medical face mask manufacturing machine non woven dust mask machine is the auto equipment which be used to the product of disposable face masks, be suitable for the material of no
Link: https://www.ascen.ltd/Products/mask_making_machine/ disposable medical face mask manufacturing machine also known as face mask production line,dusk mask machine,disposable face mask making machine.It is automatic output,a face mask body machine
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | , | Engineering,Maintenance,Technical Support
Dear Sir/Madam, I am having the 10 years exprience in SMT field. Currently I am working in Service industry as Senior Engineer. Specially I am exprience and trained in FUJI and Speedline machines. Earlier I worked with Manufacturing Industry.
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. The following describes the development history and development trend prediction of reflow soldering. Due to the need for miniaturization of electronic product PCB boards, chip components have appeared, and traditional soldering methods have been unable to meet the needs
.gif)
winsouce.jpg)