Industry Directory | Distributor
Most Trusted and Superior Source for NSN Parts, Aircraft, Military Needs
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Whether you are in the market for aircraft components, electrical connectors, IT hardware, or NSN parts, there is no better source of high-quality items than Integrated AOG.
New Equipment | Rework & Repair Equipment
Allgood Technology is equipped with a range of tools to rework and repair printed circuit assemblies to IPC-A-610 or your own company standards. Major Plant List: Metcal MFR-1351 Desoldering Station for through hole desoldering. Le
【Type】 XRW 【Power(W)】 50W,65W,75W 【Maximum output voltage(kV)】 ,20,25,30,35,40,50,60,65, Selection Wisman, enjoy the best services in the world... To.. Raw materials procurement to ensure that the products of best quality......... Wisman hi
Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer
Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers
Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran
DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48
Used SMT Equipment | Pick and Place/Feeders
Machine size: length 1500 * width 2000 * height 1500 (unit: mm) Machine structure: 3 groups of placement heads, different nozzles can be replaced automatically Machine specifications: standard version, front loading rack and tube load
Used SMT Equipment | General Purpose Equipment
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
Industry News | 2024-05-17 19:04:32.0
The SL-1040 takes coating performance to the next level through improved yield and uptime with enhanced selectivity and flexibility for high-volume electronics manufacturing
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Parts & Supplies | Pick and Place/Feeders
High-Speed Matrix Tray Server (Rear type) TR7D Rear mount tray server presents entire trays to the machine for direct picking (no intermediate shuttle hand off). ■ Ideal for odd shaped components or ones with bottom side features that make shuttle
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Parts & Supplies | AOI / Automated Optical Inspection
42804703 CARRIER CLIP 42762901 TIMING BELT 1/5"PX3/ 42763001 TIMING BELT 3/"P X1/ 42763801 CYLINDER,SPECIAL 3/4 42765301 PAD,PUSHER 42766001 TUBING(5/32) 42766201 CONNECTOR, MALE 10-3 42766301 FLOW CONTROL/FITTING 42767001 CYLINDER,RODLESS
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
This video is no longer up-to-date - please visit the URL below for the latest Mix-Tek video: https://youtu.be/YCAO5HpVhkg Datamate Mix-Tek - High-Rel Mixed Layout Connectors combine signal (3A), power (20A) & coax (6Ghz) contacts to reduce PCB foot
High quality PCB depaneling machine / V-cut PCB depanelizer,multi-blade depaneling machine,Pcb Separator Feature 1. The shaft of the knives( top and bottom) is design to be an an integral whole, it is convenient to install, pick and place. 2.T
Events Calendar | Tue Oct 15 00:00:00 EDT 2019 - Tue Oct 15 00:00:00 EDT 2019 | ,
IPC/WHMA Wiring Harness Innovation Webinar Series
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
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1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_tyco_connector_press.html
. Typical time for shuttle in, press and shuttle out is 6-10 seconds. Tooling Insertion Tool Type – Fixed (to ram) Support Tool – Shuttle mounted fixture Standard (non-sensing) and PPS
Heller Industries Inc. | https://hellerindustries.com/parts/582722/
: +1-973-377-6800 Ext 5 RAIL CONNECTOR E-Mail Us: Fields with * are required. Don't forget to learn about our new reflow oven! Please note there are 2 Hellers out there
