Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
Electronics Forum | Tue Oct 06 15:41:14 EDT 1998 | Mike C
| | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medium b
Electronics Forum | Thu Oct 08 22:06:44 EDT 1998 | Eric R
| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Parts & Supplies | SMT Equipment
ORIGINAL SMT SPARE PARTS JUKI 2040 ZT DRIVER E9627729000 TA8074N4E2 JUKI Nozzle Specifications: Brand Name JUKI DRIVER Part Number E9627729000 Model Number TA8074N4E2 Ensure Tested buy juki Guarantee 1 month usage for machine JUKI KE2040
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JUKI FX-1 E2155725000 AWC BELT (M L) E21517150A0 FRONT RAIL S ASM. E2151723000 RUBBER RING E2151725000 AWC BRACKET F E2151802000 STOPPER BRACKET RA E21527150A0 REAR RAIL S ASM. E2152721000 DRIVE SHAFT C E21527230B0 PAD BLOCK ASM E2152729AA0
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2008-03-13 13:02:50.0
Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique.
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
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: Within 5 Days After Payment MOQ: 1 Piece After-sales Service: Free For Replace Port: Shenzhen High Light: Yamaha Calibration Glass , Kmo-M880a-101 , Smt Calibration Glass YAMAHA Calibration Glass QFP KMO-M880A-101 SMT CALIBRATION GLASS P/N:KMO-M880A-101
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
application. An HVM ready tool has been developed for this process. From theoretical analysis and experimental data, the system shows clear technical advantage of improving solder bump coplanarity, which provides better solder volume and height allowance for
