1297 crack at solder ball / package junction results

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com

SMT Express, Volume 2, Issue No. 5 - from SMTnet.com

Featured Article Return to Front Page Soldering Technolo

CF9 Documentation Package

GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf

CF9 Documentation Package Documentation Package for CF-9 Taped Radial Component Lead Former PN 901-1-01 CONTENTS of CF-9 Documentation Package Operating Guide In addition to installation, set up, and

GPD Global

4670 - Junction Module- I.D.C 50pin - Obsolete if not in stock

Heller Industries Inc. | https://hellerindustries.com/parts/4670/

? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination

Heller Industries Inc.