New SMT Equipment: debug to component level (31)

GenesysTM 750W and 1.5kW, up to 200A

GenesysTM 750W and 1.5kW, up to 200A

New Equipment |  

The GenesysTM family of programmable power supplies sets a new standard for flexible, reliable, AC/DC power systems in OEM, Industrial and Laboratory applications. Available in two power levels (750W or 1500W) and with available output voltages from

TDK - Lambda Americas

FlexTC Laboratory Benchtop Temperature Forcing System From -55⁰C to +155⁰

FlexTC Laboratory Benchtop Temperature Forcing System From -55⁰C to +155⁰

New Equipment | Test Equipment

Hi-tech Breakthrough in Fluid Free Operation • High performance and fast transition rates • Temperature accuracy of ±0.2°C • Compact and portable design • No compressed air required • Ultra quiet operation • Low cost of ownership • Maintenance free •

Mechanical Devices

Electronics Forum: debug to component level (36)

Encapsulating prior to Potting

Electronics Forum | Wed Feb 25 11:37:01 EST 2015 | jasonnova

We have a customer with an assembly that will require potting using 3M DP-270. There is a component that needs to be covered with potting material but it is considerably higher than the overall potting height of the cavity. The low viscosity of the

Converting to 'No-Clean' process

Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa

Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor

Used SMT Equipment: debug to component level (2)

Agilent 81949A Compact Tunable Laser Source, 1520nm to 1630nm

Agilent 81949A Compact Tunable Laser Source, 1520nm to 1630nm

Used SMT Equipment | General Purpose Test & Measurement

We ship worldwide. Please feel free to contact us if you need further information. Agilent 81949A Compact Tunable Laser Source, 1520nm to 1630nm Key perfomance values High optical output power: +13 dBm Wide tuning range: 1520nm-1630nm Absolute

Shenzhen Zhongce Photoelectric Technology Co., LTD

Agilent 81989A Compact Tunable Laser Source, 1465nm to 1575nm

Agilent 81989A Compact Tunable Laser Source, 1465nm to 1575nm

Used SMT Equipment | General Purpose Test & Measurement

Key Features & Specifications High optical output power: +13 dBm Wide tuning range: 1465nm-1575nm Built-in wavemeter for excellent accuracy: +/-20pm Built-in coherence control Stimulated Brillioun scattering suppression Description Keys

Shenzhen Zhongce Photoelectric Technology Co., LTD

Industry News: debug to component level (540)

Automatic Dispense Repeatability for All Fluid Types GPD Global to Debut FPC at SMTA International

Industry News | 2013-10-08 18:35:41.0

GPD Global will debut its patent-pending FPC (Fluid Pressure Control) Dispensing System at SMTA International. FPC offers a breakthrough in uniform fluid dispensing by ensuring a consistent supply of fluid to the pump regardless of reservoir size or fluid level.

GPD Global

GPD Global to Debut New Technology for Fine Line and Nano Shot Dispensing at SEMICON West 2013

Industry News | 2013-06-10 17:08:51.0

GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company's new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.

GPD Global

Technical Library: debug to component level (2)

Ultrathin Fluoropolymer Coatings to Mitigate Damage of Printed Circuit Boards Due to Environmental Exposure

Technical Library | 2016-05-19 16:03:37.0

As consumers become more reliant on their handheld electronic devices and take them into new environments, devices are increasingly exposed to situations that can cause failure. In response, the electronics industry is making these devices more resistant to environmental exposures. Printed circuit board assemblies, handheld devices and wearables can benefit from a protective conformal coating to minimize device failures by providing a barrier to environmental exposure and contamination. Traditional conformal coatings can be applied very thick and often require thermal or UV curing steps that add extra cost and processing time compared to alternative technologies. These coatings, due to their thickness, commonly require time and effort to mask connectors in order to permit electrical conductivity. Ultra-thin fluorochemical coatings, however, can provide excellent protection, are thin enough to not necessarily require component masking and do not necessarily require curing. In this work, ultra-thin fluoropolymer coatings were tested by internal and industry approved test methods, such as IEC (ingress protection), IPC (conformal coating qualification), and ASTM (flowers-of-sulfur exposure), to determine whether this level of protection and process ease was possible.

3M Company

Autonomous Driving - New systems to optimally apply potting media

Technical Library | 2019-10-17 08:44:01.0

There has been an increase in sealing and encapsulation applications mainly in the field of autonomous driving. Safety and assistance systems already make driving safer and more comfortable today. With increasing progress even more electronic systems will be added. The smooth functioning of computers, sensors, cameras, etc. - and thus our safety as road users - also depends on optimally applied potting media. These can be applied economically, quickly and with high quality in individual applications and are now mastered. With the changing mobility concepts, however, the prerequisites in manufacturing are changing. The requirements are often not fixed at the outset, but only develop during the course of the project. The aim here is to generate a flexible standard that enables attractive pricing and short delivery times. However, we are prepared for these developments: with our modular system consisting of scalable system modules. From this, individual processes can be taken and combined according to requirements. Our new LiquiPrep systems have recently become part of this modular system. They represent a further development of the proven A310 product family and enable reliable processing and conveying of self-levelling media. In addition to a significantly more intuitive operation, the LiquiPrep systems also offer higher performance thanks to a new, patented membrane pump and an optimized agitator. Image: Optimally applied sealants and casting materials form the basis for high quality and smooth functioning of the components.

Scheugenpflug Inc.

Videos: debug to component level (10)

Example of how to import CAD data and BOM files, and export setup files for ATE, flying probe ATE and design 'bed of nails' fixturing.

Example of how to import CAD data and BOM files, and export setup files for ATE, flying probe ATE and design 'bed of nails' fixturing.

Videos

www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test

UNISOFT Corporation

Example of how to import CAD data and BOM files, and export to a Selective Soldering machine program setup file.

Example of how to import CAD data and BOM files, and export to a Selective Soldering machine program setup file.

Videos

www.unisoft-cim.com/solder.htm - The ProntoSELECTIVE-SOLDERING module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB Selective Soldering machines in minutes. ProntoSELECTIVE-SOLDERING helps prog

UNISOFT Corporation

Events Calendar: debug to component level (1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: debug to component level (16)

Inside Sales Rep. to become our new VP Sales

Career Center | West Chester, Pennsylvania USA | Management,Sales/Marketing

KHATOD Optoelectronic, the worldwide leader in optoelectronic components and lighting is seeking the motivated inside Sales representative with the urge to become our next Vice President of Sales. You are to build our sales, customer base, and our s

Khatod USA Optoelectronic

DeBug Technician

Career Center | West Melbourne, Florida USA | Production

Provide technical support in all areas of manufacturing in support of in-circuit and functional test. Debug printed circuit boards and product level assemblies to the component level. Work from test procedures, electrical schematics, technical note

MACK Technologies Florida, Inc.

Career Center - Resumes: debug to component level (4)

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

tel u later

SMT Production Technician

Career Center | Clearwater, Florida USA | Maintenance,Production,Quality Control,Technical Support

I have approximately 14 years experience in the Electronics manufacturing industry. I have experience from manual assembly to machine technical support for SMT eqiupment. I also have some experience with AI equipment. I have Automatic Optical Inspect

Express Newsletter: debug to component level (832)

Partner Websites: debug to component level (3047)

Level Detect User Guide

GPD Global | https://www.gpd-global.com/pdf/doc/Level-Detect-User-Guide-22200600.pdf

Level Detect User Guide Level Detect User Guide for use with Level Detect Models 22293209, 22293218, 22293219, 22293236 Overview The optional Level Detect uses a capacitive proximity Sensor to

GPD Global

Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-to-launch-new-4800-wafer-level-bondtester-at-semicon-west

Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery

ASYMTEK Products | Nordson Electronics Solutions


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