Electronics Forum | Thu Mar 19 07:57:13 EDT 2020 | leeg
Which model of Dek265 is it?
Electronics Forum | Fri Mar 20 03:30:55 EDT 2020 | leeg
Have you tried to Zero the x and Y offset and removed the stencil and re-inserted?
Industry News | 2015-12-01 10:01:32.0
During the 2015 Annual Meeting at SMTA International, the SMTA honored members who have shown exceptional service to the association and the electronics assembly industry.
Industry News | 2019-11-06 13:32:03.0
During the 2019 Annual Meeting at SMTA International, the SMTA honored members who have shown exceptional service to the association and the electronics assembly industry.
Parts & Supplies | SMT Equipment
Belt(1004951) of MPM Momentum MOMENTUM; 125 belt 1004951 Machine Model: MPM Momentum; 125; Momentum +; Momentum Elite ...... MPM / MOMENTUM; 125 mouse P9229 MPM / MOMENTUM; 125 Thimble 9061M SUPPORT PIN MPM / MOMENTUM; 125 P10468 PC power suppl
Parts & Supplies | SMT Equipment
Belt(1004951) of MPM Momentum MOMENTUM; 125 belt 1004951 Machine Model: MPM Momentum; 125; Momentum +; Momentum Elite ...... MPM / MOMENTUM; 125 mouse P9229 MPM / MOMENTUM; 125 Thimble 9061M SUPPORT PIN MPM / MOMENTUM; 125 P10468 PC power suppl
Technical Library | 2011-06-16 18:59:43.0
Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Swiftmode's Hyperclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application. Best vacuum performance, less IPA usage and No loose fibres making the solder paste printing process mor
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Career Center | Gurgaon, India | Engineering,Management,Production,Purchasing,Quality Control
1. Quality Function Management • Ensure timely inspection at incoming, in-process & outgoing stage. • Non-conformance review & reporting. • Decision making - Right disposal of Non-conforming material. • Determination of Vendor Quality rating (VQR
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal-review-process.cfm
Journal of SMT - Paper Review Process 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
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