New Equipment | ESD Control Supplies
High performance fluxophobic stencil treatments wipes Enhance your stencil performance in seconds! Aculon is pleased to announce the launch of their latest generation of stencil coating technology. Aculon’s proprietary technology treats the undersi
New Equipment | Solder Materials
With a composition of 62% Tin / 36% Lead / 2% Silver, Kapp Electric Eutectic is a cost effective eutectic electrical/electronic solder where Lead is permissible. Silver increases the strength and vibration resistance of the joint in higher stress app
Electronics Forum | Fri Apr 21 09:03:59 EDT 2006 | choppy
I guess the first thing to look at is the temperature. We had to heat more for QFP256 on sample boards and we saw discoloration on some small parts. Just try to sense around when profiling to see what's there.
Electronics Forum | Thu Apr 20 22:14:51 EDT 2006 | raquel
hello! need ur inputs... if the Matte Sn pbfree finish of the component discolors AFTER having been exposed to bake, or, after reflow, will the base leadframe have any potential contribution to it? i know most likely suspects would be the plating pro
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2013-02-06 18:55:12.0
Kyzen, will exhibit in Booth #1403 at the upcoming Parts Cleaning Expo co-located with the Precision Machining Technology Show (PMTS), scheduled to take place April 16-18, 2013 in Columbus, OH.
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
The LIRM is a dual workstation inline laser singulation machine specially designed to handle FR4 / FR2 and flex PCBA's up to 1.6mm in thickness. It comes in 2 versions which handles different panel sizes. The system employs a green laser source
