Electronics Forum | Mon Sep 28 08:35:15 EDT 1998 | Earl Moon
| I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info
Electronics Forum | Wed Feb 01 11:47:07 EST 2006 | Mike
James, If you have a true MSD issue, then baking them AFTER your reflow is not going to fix the issue. I would have to agree with GS and look at trapped cleaner media (if your not No-clean) under the components, or inside connectors. If your runnin
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. The decision to bake components is strictly based on the status of the humidity indicator card when the bag is opened. 5. The clock of exposure time does not always stop when previously exposed components are returned to dry storage
| https://unisoft-cim.com/cells-next-step-builder.html
To use the Builder, you first must have some understanding of four tables in the CELLS database: - The OPERATIONS table describes the universe of actions or steps that can be applied to manufacturing units
winsouce.jpg)
