Industry News | 2012-02-22 01:32:21.0
Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
Heller Industries Inc. | https://hellerindustries.com/788-vertical-oven/
... then transports it up, across and back down to the line in a continuous stream... with cycle times as short as 25 seconds. Four internal thermal zones with independent time and temperature controls produce virtually any recommended curing or encapsulant profile, including two-step curing
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