Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com. ItemCapability Production TypeAlum PCB/Multilayer PCB 1-14L LaminationFR4. CEM-3. Halogen Free PCB ThicknessInner layer: min 0.1mm outer layer: 0.2-3.2mm Copper ThicknessH/
Electronics Forum | Thu Apr 20 05:57:55 EDT 2006 | Huub
Do you have experience with wear resistance of spring contacts on ENIG vs Flash Au? regards, Huub.
Electronics Forum | Mon Mar 27 09:54:35 EST 2006 | russ
Flash gold is usually to thick and will cause embrittlement of your solder joints if concentration exceeds I beleive 6% in the joint
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. The solubility of nickel in the indium is very low so diffusion-controlled growth of the intermetallic (IMC) layer is slow. On exposure to air, nickel forms a unsolderable oxide on its surface, so it is protected with a flash coating of gold. In
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