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The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish

Heller 公司

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish

Heller Industries Inc.

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