Provider of training and consultancy to the electronics industry, includeing training videos and CDs
Industry Directory | Manufacturer's Representative
ELKO EP is a manufacturer of modular electronic devices.
The eP33/eP35 employs a number of unique features to provide fast and accurate deposition of solder paste within +/- 12 microns, namely: A heavy-duty, mono-block casting, enabling optimal mechanical rigidity. A precision, two-stage servo-driven gran
Model: EP-1 1510, EP- 2010 and EP-2515 EP-1 series profile projector is one kind of high precision measuring instrument, which is unified with optic, precision machinery and electronic measurement, mainly used for measuring and inspecting the size,
Electronics Forum | Mon Mar 05 06:50:43 EST 2012 | eps
hi send me your details i will send you a contact
Electronics Forum | Wed Mar 21 12:15:44 EDT 2012 | eps
We are looking for an English version eprom ( XP116 V1.07 )of a Dek 260 screen printer can anyone help
Used SMT Equipment | Conveyors
Make: Electro Design for Mydata Model: EP708 Details: 78.5" Total Conveyor Length Edge Belt 4-Stage Power: 100/240VAC ~ 50/60Hz Condition: Complete & Operational Location & Shipping: LCI NH / FOB Origin Availability: Immediate for purchase / 1-
Used SMT Equipment | Pick and Place/Feeders
ASM Siplace HF-3 Pick And Place Machine Features: The SIPLACE HF-3 placement the system is particularly suitable for applications that demand a high level of flexibility, utmost precision, and a high placement rate. Vintage: Year 2006 PCB Directi
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-02-18 08:45:21.0
Reports 2002 Revenue at 92% of Target
Parts & Supplies | SMT Equipment
SAMSUNG EP-2 SMT HIGH GRADE LUBRICATING OIL
Parts & Supplies | SMT Equipment
SAMSUNG EP-2 SMT HIGH GRADE LUBRICATING OIL jenny@ksunsmt.com
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
Technical Library | 2020-10-14 14:49:14.0
In this study, the modification of an epoxy matrix with different amounts of cube-like and rod-like CaCO3 nanoparticles was investigated. The effects of variations in the morphology of CaCO3 on the mechanical properties and thermal stability of the CaCO3/epoxy composites were studied. The rod-like CaCO3/epoxy composites (EP-rod) showed a higher degradation temperature (4.5 _C) than neat epoxy. The results showed that the mechanical properties, such as the flexural strength, flexural modulus, and fracture toughness of the epoxy composites with CaCO3 were enhanced by the addition of cube-like and rod-like CaCO3 nanoparticles. Moreover, the mechanical properties of the composites were enhanced by increasing the amount of CaCO3 added but decreased when the filler content reached 2%. The fracture toughness Kic and fracture energy release rate Gic of cube-like and rod-like CaCO3/epoxy composites (0.85/0.74 MPa m1/2 and 318.7/229.5 J m
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 ✦Product Description✦ 1606XL480EP DISCONTINUED BY MANUFACTURER POWER SUPPLY 1606-XL SERIES INPUT VOLTAGE - 100-240 V AC RATED
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Suwanee, Georgia USA | Engineering,Research and Development
MacDermid Alpha Electronics Solutions, an Element Solutions, Inc. business and world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is
Career Center | Villupuram, India | Production
BE in ECE, Working in one of the EMS industry (V NET TECHNOLOGY PVT LTD) in Pondicherry. Above 4 years of experience in SMT & PTH Process Cum Production line. Keyskills Process control, Planning, Manpower, 5S, Kaizan, FMEA, Six sigma, OEE
Career Center | Villupuram, India | Production
BE in ECE, Working in one of the EMS industry (V NET TECHNOLOGY PVT LTD) in Pondicherry. Above 4 years of experience in SMT & PTH Process Cum Production line. Keyskills Process control, Planning, Manpower, 5S, Kaizan, FMEA, Six sigma, OEE
| https://ipcapexexpo.org/exhibitors/general-artwork-format-specifications
? 2022 Exhibit Contract Booth Space Selection Guidelines Display Regulations Event Rules and Regulations For Attendees Home Registration Exhibitor Registration General Artwork Format Specifications File Type Required: Adobe Illustrator (.eps or .ai) Adobe Photoshop (.psd or .tif
