SMTnet Express, January 31, 2019, Subscribers: 31,643, Companies: 10,701, Users: 25,678 Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor Credits: General Electric Due to the arrayed nature
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
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cover strip control unit 00341699-01 COVER TAPE SHORT 00341702S01 Cover strip control unit set 3x8mm feed. 00341703S02 Flaps assy 00341726S01 Stay-bolt 00341745S02 Chair profile 24-72mmS with pins 00341746S02 Chair profile 12-16mmS with pins 00341747S02 Counterplate with pressed-in pins 00341748S02
