BurnTec is a UK based electronics company which supplies, supports, repairs and calibrates a wide range of universal device programmers including portable, PC based and gang programmers.
Embedded System Tools including Starter Kits, Emulators, In System Programmers (ISP), Gang and Universal Programmers, C Compilers, Education and Training Tools and more. Target microcontrollers are AVR, PICmicro, COP8, ST7, 8051, MC11 plus memory.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Universal Gang Programmer Ultra-Fast High Speed NAND Flash Gang Programmer Support NAND FLASH, NOR FLASH, Serial EEPRO/FLASH and more Ultra-high programming speed. Programs four devices in parallel. PC hosted, network and stand-alone(no PC req
Electronics Forum | Mon Mar 26 18:25:09 EDT 2018 | tey422
As far as I know, the gang picking or not, it has to do with the pick positions. By what I mean is the X positions and Y positions have to as close to parallel for all those feeders in order for "gang pick" to work. If one of the feeder XY position
Electronics Forum | Wed Jan 24 09:13:59 EST 2018 | cyber_wolf
Umm ask Juki ?
Used SMT Equipment | Chipshooters / Chip Mounters
Type of machine: CM602-L var. A2, RtoL flow (4xHi speed 12NZ heads incl. outlet conveyor, no direct tray tower) Year of production 2006 Model: NM-EJM4A Ser. No.: 10FV0296 (Him No: 2216514)
Used SMT Equipment | Pick and Place/Feeders
Type of machine: DT401-F, R to L flow (1x 3NZ head, incl. direct tray tower (rear side) Year of production 2006
Industry News | 2003-06-30 08:19:29.0
Merix has also entered into an agreement with YCH GROUP PTE. LTD to support its inventory hub, which is also in Suzhou.
Industry News | 2012-11-13 09:38:51.0
Count On Tools Inc., recently expanded its manufacturing operations at its Gainesville, GA headquarters for the second time in recent months.
Parts & Supplies | Pick and Place/Feeders
PANASONIC feeder gang N610073915AC
40.jpeg)
Parts & Supplies | Pick and Place/Feeders
PANASONIC feeder gang N610073914AC
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
Original used Panasonic CM402/CM602 feeder gang cart available for sale. The part number is P/N: N610056962AA and N610064416AA Gang carts are in good condition. Please let us know if you need. Thanks and best regards, Sophy
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_minimum-gang-solder-mask-web_topic2381.xml
PCB Libraries Forum : Minimum Gang Solder Mask Web PCB Libraries Forum : Minimum Gang Solder Mask Web This is an XML content feed of
| https://www.feedersupplier.com/updateinquiry.html
! Your message has been sent to the following supplier OR You can contact this supplier by following ways To: Ms. Sophy Luo Address: Building 20, Tan Tou Western Industrial Zone, Song Gang, Bao An, Shenzhen 518105 Phone
winsouce.jpg)
.gif)
