Industry Directory | Manufacturer
EBSO develops and manufactures cutting and bending machines for Thru Hole components and is a competent solution partner around Selective Soldering.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Masach Tech specializes in board level EMI/RFI shielding design and production. Founded in 1994, Masach is a globally recognized and leading supplier of some of the world’s largest electronic companies, driven by highest quality..
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Solder Materials
The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Wed Aug 06 14:49:06 EDT 2014 | dyoungquist
Sn62Pb36Ag2 has a higher liquidus point of 189C as compared to Sn63Pb37 at 183C. You may need to slightly adjust your oven profiles to use it compared to SnPb. We have had good solder-ability and reliability with it in our IPC Class II products. A
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
.jpg)
Used SMT Equipment | AOI / Automated Optical Inspection
3D Hybrid optical inspection system (AOI) YSi-V The YSi-V is the first in the industry to utilize both a 12Megapixels industrial grade high-resolution camera, along with a high-pixel compatible telecentric lens having the high-resolution indispensab
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2018-09-06 12:12:07.0
GPD Global offers the ideal tabletop robots (Catalina Series) for precision dispensing.
Parts & Supplies | Soldering - Wave
Spray-on Fluxer Device TAF40-12V, TAF40-15PV This is an automatic spray device to apply the post-flux: It is used in order to better soldering effect when you use the Wave Soldering Device (below). You can change the amount of the post-flux qui
Parts & Supplies | Soldering - Wave
Spray-on Fluxer Device TAF40-12V, TAF40-15PV This is an automatic spray device to apply the post-flux: It is used in order to better soldering effect when you use the Wave Soldering Device (below). You can change the amount of the post-flux qui
Technical Library | 2023-01-17 18:07:31.0
To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Wave soldering is the standard process that has been in use for many years to solder parts onto a circuit board. ... Selective soldering is an automated system that pumps molten solder up from a reservoir through a nozzle to coat the leads extending
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Clinton, Connecticut USA | Production
Assembler position available for contract manufacturer of printed circuit board assemblies. Includes soldering and mechanical assembly. Full time position with good benefits. Higher pay for those applicants that have or can display soldering skills.
Career Center | Clinton, Connecticut USA | Production
Assembler position available for contract manufacturer of printed circuit board assemblies. Includes soldering and mechanical assembly. Full time position with good benefits. Higher pay for those applicants that have or can display soldering skills.
Career Center | NAGERCOIL, Tamil Nadu India | 2017-06-10 13:44:05.0
Production,Quality Control
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About FREE Company Listing! Wave Solder Process Considerations & Set
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
Lead Free Solder Paste Dispensing, Leaded Solder Paste Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
Solder Selection Guide Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
