Industry Directory | Consultant / Service Provider
PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
New Equipment | Rework & Repair Equipment
Through-holes or vias can be damaged in the handling of PCB's or through the improper removal of a device. The BEST Through-hole Repair Kit can assist in the repair of these through-holes to make them look as good as new. BEST Through-hole repair ki
New Equipment | Rework & Repair Equipment
Eyelets are made from copper and are tin electronplated unless specified. Chose the proper eyelet keeping the following in mind: LUF The length of the eyelet barrel under the flange should be 0.020-0.035”/0.630-0.890mm greater than the thickness of
Electronics Forum | Wed Dec 17 09:53:26 EST 2003 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require. If we can�t get proper hole fill after try
Electronics Forum | Wed Feb 28 21:42:56 EST 2007 | davef
Very smart, Chunks.
Used SMT Equipment | AOI / Automated Optical Inspection
Make: SakiModel: 3Di-LD2 Details:1.Multiple Sizes Supported: 50 x 60 mm to 500 x 510 mm.2.High Resolution: 7 µm to 18 µm.3.Power Adaptability: 200-240V, 50/60 Hz.4.Clearance Height: Top 40 mm, Bottom 50 mm.5.Machine Dimensions: 1040 x 1440 x 1500 mm
Used SMT Equipment | AOI / Automated Optical Inspection
Large PCB manual included center board supports and J-Lead options Hardware Specifications Image Signal Input Unit * Video Camera: Triple Element CCD Camera * Light Source: 3-Ring-Shaped Fluorescent Lamps with automatic brightness control
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
High Quality Selective Wave Soldering Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. wave soldering, wave soldering machine, D
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Tampa, Florida | Quality Control
Responsibilities * Evaluates and identifies systemic problems and develops cause and corrective actions using Six Sigma tools. * Interfaces with internal and external customers on a quality issues. * Reads and interprets contracts and print packages
Career Center | Tampa, Florida USA | Engineering,Quality Control
DescriptionEvaluates and identifies systemic problems and develops cause and corrective actions using Six Sigma tools.* Interfaces with internal and external customers on a quality issues.* Reads and interprets contracts and print packages. Generates
Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support
SMT MACHINE OPERATION, FORKLIFT CERTIFY, SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.
Career Center | Gurgaon, India | Engineering,Management,Production,Purchasing,Quality Control
1. Quality Function Management • Ensure timely inspection at incoming, in-process & outgoing stage. • Non-conformance review & reporting. • Decision making - Right disposal of Non-conforming material. • Determination of Vendor Quality rating (VQR
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
| https://www.eptac.com/faqs/ask-helena-leo/ask/insulation-clearance-for-solid-wire
Insulation Clearance for Solid Wire - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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