Industry Directory | Distributor
Indenting Agent cum Authorised Distributor for RAW MATERIALS used in PCB mfg & assembly
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New Equipment | Test Equipment
The CSM Instruments Micro-Hardness Tester provides over three decades of normal force range and thus is ideally suited to the mechanical characterization of hard coatings, thick soft coatings and bulk materials. It provides accurate and reproducible
New Equipment | Test Equipment
The Micro Scratch Tester is widely used to characterize adhesion failure of thin films and coatings, with a typical thickness below 5 µm. The MST is also used in the analysis of organic and inorganic; soft and hard coatings. Applications include thin
Electronics Forum | Tue Jun 05 08:40:46 EDT 2012 | rway
How deep is the indent? I would say as long as it is hitting nothing but net (the solder fill), your fine. Besides, you should notice indents on your solder fillets of components on the top-side as well. This is also expected and acceptable.
Electronics Forum | Thu Feb 03 20:24:02 EST 2022 | dwl
Do you see foot indentations in the paste? If the part is being blown after placement, you'll see the indentations in the paste. Another random thought; We had worn nozzles and the camera would sometimes see a spot where the paint wore off and read
Used SMT Equipment | Conveyors
1.34M long edge belt conveyor. Left to Right process flow, front fixed rail. We can program for point to point transfer, or indexing for post reflow use. Hand crank for up to 18 inch width. small indent in front panel. no other defects. (110V)
Industry News | 2011-07-26 17:11:30.0
Nanovea introduced its patent pending breakthrough method of reliably acquiring yield strength through indentation; ultimately replacing the traditional tensile testing machine for yield strength measurement.
Industry News | 2010-05-12 13:26:33.0
Lights that deliver low angle illumination onto a surface, enhancing contrast of raised, indented or textured features. Due to long life, low energy consumption, and minimal maintenance, LEDs provide financial and environmental return on investment.
Parts & Supplies | Pick and Place/Feeders
YMH CL-Type Part Name：HAND LEVER ASSY PART No：KW1-M114A-00X Part Name：SPROCKET AXIS ASSY PART No：K87-M112L-10X Part Name：INDENTATION LVR ASSY PART No：KW1-M1192-00X Part Name：LEVER AXIS PART No：KW1-M116K-00X Part Name：RACKING LEVER ASSY
Parts & Supplies | Pick and Place/Feeders
YAMAHA FEEDER PARTS Part Name：HAND LEVER ASSY PART No：KW1-M114A-00X Part Name：SPROCKET AXIS ASSY PART No：K87-M112L-10X Part Name：INDENTATION LVR ASSY PART No：KW1-M1192-00X Part Name：LEVER AXIS PART No：KW1-M116K-00X Part Name：RACKING LEVER
Technical Library | 2019-06-18 10:18:00.0
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
700 X 800 X 950mm 0.05mm Precision Hot Bar Soldering Machine Automatic Soldering Robot Equipment operation description The main parameters of the hot press equipment are temperature, time and pressure,and the three elements are controlled, and
KingFei SMT Tech | http://www.smtspare-parts.com/sale-9398215-yamaha-ys24-x-axis-cable-chain-pisco-black-plastic-smt-conveyor-chain-yamaha-spare-parts.html
: KHY-M2267-00X 3, Brand: Pisco 4, Model: SP2550 R 70 5, Material: Plastic 6,Working Machine: Yamaha YS24 surface Mount Machine KW1-M2292-00X INDENTATION LVR ASSY KW1-M3292-00X INDENTATION LVR ASSY KW1-M119L-00X
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/few-questions_topic1317.html
. First impression is really good. I have few issues though. 3D generated model of SOP package does have indentation mark (white circle), but 3D model of SOIC package does not have it
