Specialists in SMT assembly systems, BGA assembly, BGA rework, and the MicroMesh stencil system.
We sell high quality soldering station, rework station, lead free soldering and infrared soldering stations. We also accept OEM orders.
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Assembly Services
Unique advanced long-time heating system 1. Equipped with high efficiency and energy saving Swedish NI-CR heating tube, radiation power peak wavelength 4 UM, with surface reflector, high thermal efficiency, temperature rise speed, the forced air cir
Electronics Forum | Mon Sep 27 06:36:34 EDT 2010 | san_1023
At present, Infrared soldering technology became popular due to stream progress in the field of electronics. The stations become more popular among masters, engaged in repairing of composite printed-circuit boards, BGA reballing, soldering in hard-to
Electronics Forum | Sat May 17 11:11:42 EDT 2008 | azimi789
would anybody guide me about soldering and unsoldering the BGA ic with Infrared unsolder dais please? in what range of temp. and time I should set the device? (ZORAN Quatrro 4110)
Used SMT Equipment | Soldering - Reflow
• Infrared • Edge • Air • 10 Heating Zones • 2 Cooling Zones Condition: Complete and Operational, “ As is Where is” .
Used SMT Equipment | Soldering - Selective
Make: Nordson Select Model: 103IL Vintage: 2019 Description: Selective Solder Details: Lead-Free, Titanium Solder Pot and Pump Assembly Windows 10 Pro Operating System SWAK OS Software Version: 4.0.279.0 Dual Monitors Dual Process Witness Cameras
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
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Parts & Supplies | Pick and Place/Feeders
Yamaha KHM-M654C-01 Sensor, fiber 2 KHM-M654B-01 KHM-M654C-01 YS24 placement machine track light soldering sensor KHM-M654B-01 YAMAHA YS24 Orbital Optical Solder Sensor YS24 Optical Solder Sensor YG12 KHM-M654C-01 YS12 Orbital Light Solder Sensor
Parts & Supplies | Repair/Rework
PG-P6860 Main Features： 1、 The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid lo
Technical Library | 2021-09-21 20:36:45.0
The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform- Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
ETA Lead-Free Soldering Machine Infrared Reflow Oven Hot Air System Oven ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology ex
Low Cost Infrared SMD Reflow Soldering Oven ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional overse
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ The Impact of Reflowing A Pb
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/infrared-preheating
Information Datasheets Topside Infrared Preheater Videos Topside Infrared Preheater Infrared Preheating Maintains Topside Board Temperature During Soldering Features and Benefits
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_wave-soldering-sot23_topic995.xml
PCB Libraries Forum : Wave Soldering SOT23 PCB Libraries Forum : Wave Soldering SOT23 This is an XML content feed of; PCB Libraries Forum
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