Industry Directory | Consultant / Service Provider
A professional and specialized company in automatic Control fields Design, maintenance and upgrade all machines Maintenance of various electeonic cards using computer and modern instruments Design of various electronic circuits including microcontrol
Kemp Instruments is a proffessional multi-line representive agency providing technical sales coverage throughout the Southeast and Southwestern United States.
Partial List of Services • single/double Multi-layer (up to 30) • SMT & Through-hole • Quick-turn Prototypes • Production Quantities with Scheduled Deliveries • Blind Via • Buried Via • 0.5mm pitch • IPC Standards • 24-hour multi-layer quick-tur
The ideal solution for any market. Genesis features a powerful combination of speed and flexibility to blur the boundaries between high-speed and flexible fine pitch placement. Outstanding price performance combines with traditional Universal uptime
Electronics Forum | Tue May 30 10:17:07 EDT 2000 | g cronin
I thought I saw that there is a retro kit required to supply the proper power to the multi pitch feeders from older machines. Check the Universal web site for info on the multi pitch I think that is where I read about it...
Electronics Forum | Tue May 30 14:49:03 EDT 2000 | Kris W
Dreamsniper, The only difference that I am aware of is that you have to change the component definition to match the feeder. The Multi-pitch feeders locate the tape in a different location than the standard feeders. We have been using the multi-pi
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp
Used SMT Equipment | Flexible Mounters
Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-04-30 08:37:19.0
Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs
Parts & Supplies | Assembly Accessories
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Parts & Supplies | Pick and Place/Feeders
GSM Multi Pitch Feeder 16mm 47175802
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
Attractive price smt multi magazine loader with CE certificate APPLICATION: The Single magazine loader is used at the starting of the line for loading of PCB’s to the production line. The unit loads the production line automatically by push
Attractive price smt multi magazine loader with CE certificate APPLICATION: The Single magazine loader is used at the starting of the line for loading of PCB’s to the production line. The unit loads the production line automatically by pushing PCB’
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Wed Mar 01 07:00:00 EST 2017 - Thu Mar 02 11:00:00 EST 2017 | Dallas, Texas USA
Corporate Crisis and Security Forum
Manufacturers Alliance for Productivity and Innovation (MAPI)
Career Center | Raleigh, North Carolina USA | Quality Control
Director of Quality responsible for multiple facilities within an SMT electronics manufacturing operation. Must be willing to travel, coordinating quality systems, philosophies, and direction to other locations. Will play an instrumental role in la
Career Center | Santa Clara, California | Engineering
RF TEST TECHNICIAN Job Summary: Responsible for performing the set-up, calibration, testing, and troubleshooting of circuits, components, instruments, and mechanical assemblies. Determines and may develop test specifications, methods and procedures f
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Karachi, Pakistan | Engineering,Maintenance,Research and Development,Sales/Marketing,Technical Support
• Experienced in SMT Production, working on Siplace X Series-S and DEK-Micron Printer, on Siplace Pro and Siplace Explorer. • Having Strongly Skills of calibration of SMT machine, twin head, Multi star head, speed star head, gentry, Nozzles, feeders,
The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards Universal Instruments Credit/Source: Jay B. Hinerman, K. Srihari, Ph
Lewis & Clark | https://www.lewis-clark.com/product/universal-instruments-uic-10mpf-1140-multi-port-nozzle-51305325/
Universal Instruments UIC 10MPF 1140 Multi Port Nozzle 51305325 - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
| https://www.feedersupplier.com/sale-13118719-smt-spare-part-universal-16mm-multi-pitch-feeder-47175804-for-universal-pick-and-place-machine.html
SMT spare part Universal 16mm Multi-pitch feeder 47175804 for Universal pick and place machine Leave a Message We will call you back soon
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