Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Industry Directory | Training Provider
IPC Training from BEST - a professional solder training company that certifies technicians in various IPC certification programs. We also offer custom BEST courses that include hand soldering and PCB rework.
New Equipment | Education/Training
The IPC J-STD-001 Training for the instructor is a class on the necessities for Soldered Electrical and Electronic Assemblies is a universal standard with wide acceptance on the assembly of printed circuit boards. The IPC J-STD-001 Training explains
New Equipment | Education/Training
The IPC-J-STD-001H is a gloablly recognized and accepted assembluy standard for printed circuit boards as it spells out the criteria on soldering processes and materials. This version was updated in late fall of 2020 and brings the latest
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high
Industry News | 2013-09-03 11:52:21.0
BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects
Industry News | 2016-09-01 12:07:57.0
A new class has been developed to teach EMS providers and others the basics of wire harness assembly techniques. This class goes along with the popular IPC-A-620 Wire and Cable Harness Assembly Acceptance standards.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2012-10-04 18:52:43.0
First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ON DEMAND | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Events Calendar | Sun May 03 18:30:00 UTC 2020 - Sun May 03 18:30:00 UTC 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Events Calendar | Wed Feb 19 18:30:00 UTC 2020 - Wed Feb 19 18:30:00 UTC 2020 | Manchester, New Hampshire USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Career Center | Springfield, Virginia USA | Production
We need someone who is excellent at hand solder of through hole and SMT componets to pcb. Must be capable and content performing the task. IPC certification helpful but will accept experienced person that can perform the task to IPC standards.
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Juneau, Wisconsin USA | Engineering,Management,Production,Quality Control
DAVID A BOND N5116 Sinissippi Point Road ? Juneau, Wisconsin 53039 ? (920) 349-3094 ? E-mail: tex007@charter.net SUMMARY A professional, results-oriented Product and Process Engineer with extensive experience in manufacturing. Proven s
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
. IPC-J-STD-001 uses 3 classes to define solder joint goal acceptability for various electronic products. CLASS 1 – General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. Toys CLASS 2
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-specialist/ipc-a-600-cis/
:00 IPC-A-600 Certified IPC Specialist (CIS) OPERATOR ACCEPTABILITY OF PRINTED BOARDS EXTERNAL & INTERNAL BARE BOARD This course is designed to certify Operators/Inspectors in identifying characteristics that may occur either internally of externally in the printed circuit board
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