Electronics Forum: ipc-7095b (1)

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas

We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss

Industry News: ipc-7095b (2)

Kurtz Ersa Mexico, SA DE C.V. Sees Growth from SMTA Gualajara

Industry News | 2014-04-17 09:06:40.0

Kurtz Ersa Mexico, S.A. DE C.V.is pleased to announce its success at the recent SMTA Guadalajara Expo & Tech Forum that took place in Queretaro, Mexico.

kurtz ersa Corporation

Meet the Kurtz Ersa Team at SMTA Guadalajara

Industry News | 2014-09-13 19:26:12.0

Kurtz Ersa to Exhibit Rework Technology at SMTA Guadalajara.

kurtz ersa Corporation

Partner Websites: ipc-7095b (3)

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

Joints,” Proceedings of SMTAI 2006, 406-415, Chicago, IL, September 2006. [4] IPC-A-610D, “Acceptability of Electronics Assemblies,” Section 8.2.12.4, 8-83, IPC, February 2005. [5] IPC-7095B, “Design and Assembly Process Implementation for BGAs,” Section

Heller Industries Inc.


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