New SMT Equipment: land patterns change cause (6)

MALCOM STA-2 Solder Impurity Tester

MALCOM STA-2 Solder Impurity Tester

New Equipment | Solder Materials

Soldering is now lead-free. Reflow soldering quality with solder paste can be maintained by controlling the furnace temperature or determining the temperature profile on condition that the solder paste material is decided and the materials, surface t

Seika Machinery, Inc.

Omron 3D AOI VT-S730

Omron 3D AOI VT-S730

New Equipment | Inspection

Omron 3D AOI VT-S730 FOV 30.00×30.72mm max PCB:510(W)×460(D) mm Weight Approx. 800kg Dimensions 1100(W)×1470(D)×1500(H) mm  INQUIRY Omron 3D AOI VT-S730 Specifications: Features features vt-s730 aoi Top View 4Mpixel/12Mpixel Camera with Te

Fomyn Equipment co,.ltd

Electronics Forum: land patterns change cause (92)

Min spacing for land patterns from PCB edge

Electronics Forum | Tue Mar 18 12:38:39 EDT 2008 | fsw

Hi! Can anyone tell me what is the min spacing between PCB edge & land pattern to avoid cracking of components due to mechanical stresses caused while depaneling with cookie/pizza cutter. Thnx!

Stencil deformation patterns

Electronics Forum | Tue May 22 02:27:50 EDT 2018 | bukas

there are numerous factors: -stencil age -stencil finish and thickness -stencil-board vertical alignment -board support -squeegee pressure -squeegee blade material and condition question here is did stencil changed its dimension over time? ar

Industry News: land patterns change cause (44)

Photronics Names John Chin Vice President - Asia

Industry News | 2003-07-09 09:00:46.0

He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.

SMTnet

InDigiNet To Acquire 2.5million in Assets

Industry News | 2003-05-08 07:11:45.0

InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.

SMTnet

Videos: land patterns change cause (1)

PCB Assembly Process in Makerfabs

PCB Assembly Process in Makerfabs

Videos

In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com

Makerfabs

Training Courses: land patterns change cause (1)

Events Calendar: land patterns change cause (1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Resumes: land patterns change cause (2)

Safety Professional

Career Center | Savannah, Georgia USA | Engineering,Human Resources,Maintenance,Management,Production,Quality Control,Research and Development,Technical Support

I’d like to give you a brief overview of my skills and experience.  I am confident that I could bring value to the SMTnet as your Safety Professional.  Here’s how my qualifications meet your requirements: • Military (E-7) Manager with experience as

Sr. Systems Analyst, Sr. Software Engineer

Career Center | Vestal, New York USA | Engineering,Research and Development

Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using

Express Newsletter: land patterns change cause (478)

Partner Websites: land patterns change cause (1694)


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