Industry Directory | Manufacturer
Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.
Industry Directory | Manufacturer
EO Technics is a rapid growing Laser Marker/Application Manufacturing company, placing the emphasis on quality and customer satisfaction. EO Technics headquarter is in Anyang, Korea, with International Corporations worldwide in the US and Singapore, two branches in Philippines and Malaysia. EO Technics expands a new developing corporation in Taiwan and a new branch in Europe underdevelopment t
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
ASCEN PCB depaneling machine as pcb separation equipment mainly use for the PCB assembly in the large mass production with the high efficiency and save a lots of labor for the manufacturer. Most of time, one set of this type PCB cutting machine&
Electronics Forum | Mon Feb 06 15:50:10 EST 2006 | ajaygarg1980
Hi, We are electrodepositing Au(0.25 to 0.5 microns) on Cu & using solder ball bonding process via laser.We are getting lots of voids within the solder (not kirkendall voids). Can anyone shed some light on this problem.We are not using any flux.Pre
Electronics Forum | Fri Mar 04 11:30:46 EST 2005 | Steve
Is anybody using via-in-pad under a BGA successfully? Is this a specialized capability, or do most board houses have the capability to do micro-via's? How small does the via need to be in order to avoid solder wicking? I understand that in order for
Used SMT Equipment | General Purpose Test & Measurement
We ship worldwide. Please feel free to contact us if you need further information. KEITHLEY 2520 Pulsed Laser Diode Test System The Keithley 2520 Pulsed Laser Diode Test System is an integrated, synchronized system for testing laser diodes early
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Used SMT Equipment | Pick and Place/Feeders
Samsung CP40C Pick and Place Machine Vintage: 2004 3 Multi-functional heads with CyberOptics laser alignment system CyberOptics Laser auto centering 13,800 CPH 20 Pocket Auto Nozzle Changer Windows-based GUI operating system Component Range 04
Industry News | 2018-02-12 12:28:00.0
GPD Global introduces its NEW full-featured benchtop dispensing robot system: Catalina. A benchtop system does not mean "no features". This compact and efficient semi-auto dispense robot provides you with numerous standard features: automatic vision, laser surface sensing, and automatic nozzle alignment and calibration.
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
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Parts & Supplies | Pick and Place/Feeders
40000575+40000576 cylinder driver include cable 40023687 valve PV-1303050-00 Description: JUKI DRIVE CYLINDER Part No: 40000575 / 40000576 Condition: Original new Payment Term: T/T, Paypal, Westernunion are all allowed. Shipping Ways: DHL, Fed
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Visker Model: 8mm Part Name: Feeder Driver: Motorized Lead Time: Within 3days Machine Model: JUKI All Model SMT Machine JUKI Visker Feeder 16MM / 24MM Professional Motorized Feeder Description: Model:
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Fri Jan 11 00:00:00 EST 2019 - Fri Jan 11 00:00:00 EST 2019 | Richardson, Texas USA
SMTA Dallas Chapter - Understanding Selective Solder Technology
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Lumberton, USA | Engineering,Production
Metal Etching Technology Inc. is one of the United States leading Manufacturers of solder paste stencils for the electronics industry. Candidate's responsibilities will include printing and manipulating cad data, transferring files via internet/em
SMTnet Express, May 16, 2019, Subscribers: 31,918, Companies: 10,765, Users: 26,116 Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Credits: Cisco Systems, Inc. As the demand for higher routing density and transfer speed
ASCEN Technology | https://www.ascen.ltd/Blog/machine/PCB_depaneling_machine/824.html
with 2 separation module and 3 separation module optional via the PCB board material.The whole cutting process is divided into 2 or 3 stages
