Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Manufacturer
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Rework & Repair Services
PCB Repair Services BEST is your experienced resource for high value added PCB repair services. If you need any of the following completed to your printed circuit board then let the experts at BEST be your answer: Pad repair services Pad replace
Electronics Forum | Thu Dec 26 12:41:53 EST 2019 | emeto
We agree with your statements. 1. Having manually printed board will compromise your print and you don't know how much paste you have on each pad. 2. LEDs falling off that easily might be related to contamination, considering that your profile is not
Electronics Forum | Wed Dec 04 10:59:04 EST 2019 | dwl
The solder looks a little grainy for Sn/Pb solder but that might just be the picture quality. There appears to be plenty of solder on the pads, so I'd rule out anything to do with the stencil. One possibility that springs to mind; how long is your
Used SMT Equipment | Repair/Rework
Warranty: 90 days parts & labor against manufacturing defects - wear items not included 1IR550A000A67 1 PC IR550A Infrared Rework System - 115V/US 1600 W heating power -800 W bottom side - 135 x 260 mm -800 W top side - 60 x 60 mm 1 K-type themoco
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00358497-02 Cable HS50, Comp. Illum.Control, modular 00358644-02 KIT ELECTRIC HEAD CRASH SENSOR 00358653S04 Lifting Table Single transport 00358654S04 Lifting Table Dual transport 0035867
.jpg)
Parts & Supplies | Assembly Accessories
00358497-02 Cable HS50, Comp. Illum.Control, modular 00358644-02 KIT ELECTRIC HEAD CRASH SENSOR 00358653S04 Lifting Table Single transport 00358654S04 Lifting Table Dual transport 00358676-03 HOLDER FOR LIGHT BARRIER HT 00358684-05
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
00359433-01 Reflection Light Barrier, configured 00359434-01 Crash Light Barrier,configured 00359435-01 Neutral Position Light Barrier 00359436-01 Unlock Device WTC 00359438-01 Connection Cable: Power MTC 00359459-01 LIFTING TABLE SINGLE CONVEYO
03059051-01 Lifting Table Dual Conveyor X4i 03059195-01 Retrofit kit pneumatic unit D1 03059196-01 Gas Spring 400N ( for D1/D2 Left Hood) 03059238S01 Linear Dipping Unit (LDU) Basis 03059375-01 Starter kit filter disc 2-parts / C+
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-chamfer_topic727_post2522.html
: 5188 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 03 Dec 2012 at 3:12pm The BGA, CGA is an exception because the plastic package is lifted off the board surface by the Balls or Columns
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
,” tombstoning occurs when the component is partially or entirely lifted off from the pad, making it rise on one end, and looking like a tombstone, hence its name
