Industry Directory | Consultant / Service Provider / Manufacturer
MemoryDealers designs, manufacturers, and markets memory modules for use in Cisco, Sun, Juniper, PCs, laptops, and legacy devices. With distribution centers in the United States, United Kingdom, Korea, and Japan, MemoryDealers provides a total soluti
We carry Elpida memory and running business for more than 10 years. Our closely partner is a DRAM Module and 3C gizmo EMS.
The recognized standard for computer manufacturers, OEM/3rd party Memory Advance Memory Tester designed with the Module manufacturers and Distributors. Tests SDRAM, SIMM, DIMM, SRAM, EDO, Flash, PC100,modules.
Electronics Forum | Tue Jan 05 21:01:40 EST 2021 | brianjones
We are looking at setting up a memory module conveyor belt with a stacker and de-stacker. I will need to handle DDR3 and DDR4 Long DIMM and SODIMM. I will be mounting an image camera under and over the modules. Looks like an edge conveyor would be be
Electronics Forum | Tue Sep 28 19:22:48 EDT 2021 | kumarb
Hi. Aside from the good advice above, wish to throw in our experience with our 1809EXL. Had < 200 on-hours and the oven would not melt the assorted fresh paste we sourced from different suppliers. The s/w reported that the set temps were being
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 100A Reflow Oven Vintage: 2012 LOW HOURS Edge Rail Mesh Belt L to R Flow Programmable Width Adjust Smart Tracker SMEMA Bottom Cooling Fans 480V 3-Phase UPGRADE Kit Recently Added ($13k Value) - Intellimax 2 Module Assembly - Wincon 7.2 So
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Parts & Supplies | Assembly Accessories
After receiving the input signal of home sensor of motor related to head, it is transmitted to can master BOARD.CONVEYOR Control board receive controller The sensor input with ANC and the input of the switch on the operation panel are transmitted t
Parts & Supplies | SMT Equipment
JUKI SMT COMPONENTS E96567290A0 CPU BOARD ASM E96508550A0 BLOWER MOTOR ASM.(BM-50LR009) E9651729000 WINDOWS NT (JAPANESE) LICENSE E96517550A0 486 CPU BOARD E96517600A0 X-AXIS SENSOR CABLE ASM E9653729000 RTX LICENSE E9654755000 CCU CAMERA E9
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Career Center | San Jose, California USA | Engineering
Headquartered in San Jose, as leading PC component distributor and rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR, SD-RAM, SO-DIMM and F
Career Center | San Jose, California USA | Engineering
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR
Career Center | Costa Mesa, California | Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 17yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, Electrovert equipment. Have also done off-
Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi
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I.C.T ROUTER BRONZE-Trade Info-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> Trade Info I.C.T ROUTER BRONZE I.C.T ROUTER BRONZE This machine is required at the final stage of SMT line to cut a Panel into Modules
Lewis & Clark | http://www.lewis-clark.com/product-tag/in-circuit-test/
: 3070 Series 3 Modules : 2 Configured with: (1) Windows PC (18) HyDD cards (2) XTP (2) Asru C Service inclusions: Refurbishment Parts exchange warranty Installation optionally available. Availability
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