Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
FKN Systek K5000 - Manual board feed PCB multiple panel singulation Singulate panels with up to 10 scorelines. Singulate panels with components up to 2.5" 3 models available: - Output tray - Straight output conveyor - Right angle output
New Equipment | Board Handling - Conveyors
LED panel magazine loader is designed for unloading of PCBs, an arriving PCB is taken up by the attached conveyor and then pushed into the magazine by a specially designed pusher. The magazine indexes to the next position and is ready for the followi
Used SMT Equipment | X-Ray Inspection
Description Make: VISCOM Model: 7056-II RL Year: 2010 Type: Wave Solder Details: Refurbished in 2021 by Viscom: In-line or can be used as standalone -The entire image chain is new.-New computers with Windows 10 IOT-New Digital flat p
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight N6030A Arbitrary Waveform Generator, 15-Bit, 1.25 GS/s Keysight-Agilent N6030A arbitrary waveform generator delivers unprecedented performance for creation of complex wideband waveforms. High sampling rate and high bit resoluti
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Technical Library | 2019-10-03 14:27:01.0
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.
link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html The automatic PCB magazine loader is used at the starting of the SMT production line for loading of PCBA to the line.he unit loads the production line automatically by pu
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SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | Milwaukee, Wisconsin USA | Engineering
Cree Lighting, A company of IDEAL INDUSTRIES, is an LED lighting pioneer known for being first – first to bring LED lighting to the masses, first to deliver no compromise white light, and first to offer a sensor-integrated intelligent lighting
Career Center | Racine, Wisconsin USA | Engineering,Maintenance,Production,Technical Support
We are currently seeking a SMT Process Technician to join our already strong team in a state-of-the-art SMT/PTH facility, only 5 years old. This position will be responsible for all aspects of printed circuit board assembly, from programming of eq
SMTnet Express, June 15, 2023, Subscribers: 24,830, Companies: 11,818, Users: 28,067 █ Electronics Manufacturing Technical Articles Stencil Design For Mixed Technology Through-Hole / Smt Placement And Reflow This paper will review
-sectioning)is a technique, used
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/meters-and-metering-systems?con=t&page=6
Meters & Remote Metering Systems Divide Material Into Multiple Adhesive Streams | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
ASCEN Technology | https://www.ascen.ltd/Video_Channel/PCB_depaneling_machine/620.html
)This is Mini type PCB cutting machine with small dimention and high output.It can place on the desktop for operation.purcahse this mini type multiple panel depaneling machine is the lowest cost solution to solve the quickly depaneling PCB panel in the mass production for your factory. Manufacturer： ASCEN technology
