Manufacturer of Electronic Assemblies, overmold RFI, wire harness, and more.
Industry Directory | Manufacturer
Manufactures high-quality, high-reliability cable assemblies and connection solutions. Services include over-molding and cable repair.
Manufactures high-quality, high-reliability cable assemblies and connection solutions. Services include over-molding and cable repair.
RAD Technologies is a niche contract manufacturing company, serving the OEM marketplace. We are specialized in custom cable assemblies, assembly of complex printed circuit boards and over-molded embedded electronics. RAD has an excellent 15-year trac
Electronics Forum | Tue Apr 05 10:06:31 EDT 2011 | markhoch
I would look into Low Pressure Overmolding for this application. Seems like it would be a good fit and would seem to be far less costly. Check out: http://moldmanmachines.com/ I have no stake in the above company, but I have researched the process a
Electronics Forum | Wed Jan 13 19:13:59 EST 1999 | Michael Allen
Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype" line at our component supplier's lab (non-production overmold material was used). Production parts have not exhibite
Used SMT Equipment | In-Circuit Testers
Fluke Networks DSP-4000-120Fluke Networks DSP-4000 120 LAN TesterThe DSP-4000 Digital CableAnalyzer can boost your bottom line by providing fast, accurate testing of high-performance Cat 5E, Cat 6 and fiber optic cabling. The DSP-4000 is easy to use,
Industry News | 2020-03-08 16:49:19.0
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2020-11-24 15:24:33.0
Deadline for abstracts and proposals: January 5, 2021
Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
