Industry Directory: pad oxidation (1)

EasyBraid Co.

Industry Directory | Manufacturer

A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.

New SMT Equipment: pad oxidation (17)

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

Gold Contact Replating Kit

Gold Contact Replating Kit

New Equipment | Rework & Repair Equipment

The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m

BEST Inc.

Electronics Forum: pad oxidation (215)

Black pad analisys

Electronics Forum | Fri Nov 08 08:52:54 EST 2002 | dphilbrick

Juan There are many things that cause this and the first thing I would do is request quality records from your board fab facility on that particular lot. If they are unwilling to give them to you this is a good sign they had a processing problem. Th

solder pad with nickel plating

Electronics Forum | Wed May 11 13:50:30 EDT 2005 | russ

I would contact your paste supplier, bare nickel can be impossible to wet to. How oxidized is it?

Industry News: pad oxidation (36)

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited

Technical Library: pad oxidation (1)

ADVANCED BORON NITRIDE EPOXY FORMULATIONS EXCEL IN THERMAL MANAGEMENT APPLICATIONS

Technical Library | 2020-10-14 14:33:36.0

Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.

Epoxy Technology, Inc.

Videos: pad oxidation (17)

PCB magazine loader, SMT magazine loader, pcb loader, PCB loader machine

PCB magazine loader, SMT magazine loader, pcb loader, PCB loader machine

Videos

link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html The automatic PCB magazine loader is used at the starting of the SMT production line for loading of PCBA to the line.he unit loads the production line automatically by pu

ASCEN Technology

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: pad oxidation (2)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Career Center - Resumes: pad oxidation (1)

SMT process engineer

Career Center | NORTHRIDGE, California USA | Engineering

EDUCATION BS Electronics and Communication Engineering                Gujarat University MS Electrical Engineering        California State University, Northridge  ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE

Express Newsletter: pad oxidation (243)

Partner Websites: pad oxidation (46)

Solder Ball Defects - Heller

Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/

(overlapping solder mask) Misaligned solder mask (overlapping solder pad and print area) Flux is too weak for the oxidation level of the board and/or components Components have marginal solderability

Heller Industries Inc.

PCB Libraries Forum : PCB Design In The 1970's

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-design-in-the-1970s_topic2333.xml

;When the sketch was completed, the pencil drawing, and grid sheetwas placed on a flat light table. We overlaid a sheet of mylar on top of thepencil drawing and manually placed sticky donut pads, made by Bishop Graphicsand using an Exacto knife to create the Pad Master

PCB Libraries, Inc.


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