Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining
Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure
Electronics Forum | Mon Nov 12 10:59:24 EST 2007 | chineechooze
i got graph and proces mapping for dah ROhs
Parts & Supplies | SMT Equipment
JUKI YC or Z GREASE MGREAS050GA 40031411 BARE ADJUSTMENT JIG 40031620 LOAD CELL ASM HLC-5N 40031754 I-CX PCB 40031812 LINEAR SCALE X ASM 40031860 Y BEAR CABLES ASM 40031861 XY BEAR HEAD CABLES ASM 40032048 IN STEPPING MOTOR ASM 40032049 OUT
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/additional-filter-product-subtype/bulk-delivery-systems?con=t&page=39
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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5454
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