Industry Directory | Distributor / Manufacturer
Lorlin manufactures discrete semiconductor component test systems for small signal and power devices. 50 years in business, over 3000 installations. SMD devices: transistors, Fets, diodes, scrs, triacs, optos, and many others.
New Equipment | Test Equipment
Agilent/HP 1652B 80 CH. Logic Analyzer/ 2CH Digital Scope. The HP 1652B logic analyzer has all the features fo the HP 1650B and HP1651B plus two 400 MSa/s digitizing oscilloscope channels, automatic pulse parameter measurements, and time-correlate
New Equipment | Test Equipment
Features & Benefits All Modules Up to 70 GHz Bandwidth and 5 ps Measured Rise Time (10-90%)Lowest Noise for Analysis: 450 μVRMS at 60 GHz, 300 μVRMS at 30 GHz Remote Samplers*1 enable Location of Sampler Near DUT and ensure Best Signal Fid
Electronics Forum | Tue Jun 08 07:10:54 EDT 2004 | davef
Not quite what you seek, but as close as you're going to get ... 9850-K - Surface Mount Placement Equipment Characterization - KIT (Hard Copy & CD-ROM) ANSI Approved This standard has been developed to standardize the parameters, measurement proc
Electronics Forum | Tue Jan 26 00:21:29 EST 1999 | Parvez Patel
Ya I agree with Dean. We've done quite a lot of work with the SRT Summit2000 rework station.The results have been satisfactory, to say the least. One should however characterize the different operating parameters:namely the working scavenger air flow
Used SMT Equipment | In-Circuit Testers
Agilent 4156C Precision Semiconductor Parameter Analyzer Agilent 4156C Precision Semiconductor Parameter Analyzer Bench top solution for advanced device characterization. The superior low-current and low-voltage resolution and built-in quasi-st
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 4156C Precision Semiconductor Parameter Analyzer Agilent 4156C Precision Semiconductor Parameter Analyzer Bench top solution for advanced device characterization. The superior low-current and low-voltage resolution and built-in
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2016-01-17 11:04:34.0
The SMTA Capital Chapter is pleased to announce its first meeting of 2016 on January 27th, scheduled from 5:00 pm to 7:00 pm at DfR Solutions, 9000 Virginia Manor Road, Suite 290, Beltsville, MD 20705. The focus of this chapter meeting will be “Test Plan Development – How to Do It!” presented by Dr. Gil Sharon, DfR Solutions.
Technical Library | 2008-01-24 16:19:43.0
The wave solder process is characterized by a large number of process parameters. To understand them all and their interactions is challenging, particularly when it comes to lead-free soldering. Wave soldering has a number of sub-processes, which include fluxing, preheating, soldering and cooling.
Technical Library | 1999-05-06 14:46:09.0
Semiconductor manufacturing is characterized by very complex process flows made up of individual process steps, many of which are built to very close tolerances. Furthermore, there are complex interactions in these process flows, whereby each process step can affect many other steps, and each final device parameter might be determined by the results from many inputs...
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Events Calendar | Thu Feb 13 00:00:00 EST 2020 - Thu Feb 13 00:00:00 EST 2020 | ,
Characterizing Electronic Components
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined
